XCZU17EG-2FFVB1517E

Soc System On Chip Overview

The XCZU17EG-2FFVB1517E is a Zynq UltraScale+ MPSoC Enhanced Graphics (EG) device manufactured by AMD. It integrates a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5F real-time processor, and an ARM Mali-400 MP2 GPU with 16nm FinFET+ programmable logic. The component features up to 1.5 million logic cells, 11 Mbit of embedded memory, and supports high-speed interfaces including PCIe Gen3 x4 and Gigabit Ethernet. Operating within a temperature range of 0°C to +100°C, it utilizes a 1517-ball FCBGA package for system-on-chip implementations requiring heterogeneous processing capabilities.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining quad-core ARM Cortex-A53, dual-core ARM Cortex-R5F, and Mali-400 MP2 GPU with 1.5M logic cells
• Integrated DDR4/LPDDR4 controller supporting up to 76.8 GB/s bandwidth with ECC protection
• High-speed peripherals including PCIe Gen3 x4, 1GbE/10GbE, USB 3.0, and TSN support
• Security features including ARM TrustZone, Secure Boot, and hardware key storage

Soc System On Chip Applications

• 5G wireless infrastructure base stations
• Advanced Driver Assistance Systems (ADAS)
• Industrial IoT edge computing nodes
• Video surveillance and image processing systems

Soc System On Chip Procurement Notes

Verify the specific suffix 'E' against official AMD documentation to confirm the commercial temperature grade and operational specifications. Ensure compatibility with required power delivery sequences and thermal management solutions for the FCBGA-1517 package. Confirm availability status through authorized distributors as supply levels may vary.

Soc System On Chip Selection Notes

Select this model when applications require enhanced graphics processing alongside real-time control via the Cortex-R5F cores. Compare against EV variants if video codec integration is needed instead of GPU acceleration. Validate that the 1.5M logic cell count meets design complexity requirements and that the 1517-pin package fits the board layout constraints.

Soc System On Chip Part Context

This part belongs to the Zynq UltraScale+ MPSoC EG series, designed for high-performance computing tasks. It sits between lower-density EG models and higher-capacity devices like the XCZU19EG, offering a balance of processing power and resource density for mid-to-high-end embedded systems.

Soc System On Chip Replacement Considerations

Direct pin-compatible replacements within the same package include other XCZU17EG variants with different speed grades or temperature ranges. Cross-series migration to XCZU15EG or XCZU19EG requires re-evaluation of logic resources and I/O counts.