XCZU19EG-2FFVB1517I

Soc System On Chip Overview

The XCZU19EG-2FFVB1517I is a Zynq UltraScale+ MPSoC EG series device featuring an FPGA fabric with over 3.5 million logic cells and a dual-core ARM Cortex-R5 real-time processing unit. It integrates a quad-core ARM Cortex-A53 application processor running at up to 1.5 GHz, alongside an ARM Mali-400 MP2 GPU operating at 667 MHz. The component utilizes a 1517-pin FCBGA package and supports high-speed peripherals including PCIe Gen3, USB 3.1, and SATA 3.0. Designed for industrial temperature ranges, it provides extensive I/O capabilities and embedded memory resources for complex system-on-chip implementations.

Soc System On Chip Feature Summary

• FPGA Fabric: Over 3.5 million logic cells with 11 Mbit of embedded block RAM.
• Processing System: Quad-core ARM Cortex-A53 (up to 1.5 GHz) and dual-core ARM Cortex-R5 (up to 600 MHz).
• Graphics: Integrated ARM Mali-400 MP2 GPU clocked at 667 MHz.
• High-Speed Interfaces: Supports PCIe Gen3, USB 3.1, SATA 3.0, and Gigabit Ethernet.

Soc System On Chip Applications

• Industrial automation and control systems requiring deterministic real-time performance.
• Medical imaging devices utilizing integrated GPU acceleration and high-speed data acquisition.
• Test and measurement equipment needing flexible FPGA logic and robust processor integration.
• Video surveillance and analytics platforms leveraging Mali-400 MP2 processing capabilities.

Soc System On Chip Procurement Notes

Verify the suffix 'I' confirms the industrial temperature range specification (-40°C to +100°C TJ). Confirm the 1517-pin FCBGA footprint compatibility during PCB layout. Ensure supply chain sources provide authentic AMD components to avoid counterfeit risks associated with high-density SoC devices.

Soc System On Chip Selection Notes

Select this model when designs require significant FPGA capacity exceeding 1 million logic cells combined with multi-core ARM processing. Compare against lower-tier EG variants if logic density or specific peripheral counts are not fully utilized. Validate that the 1517-pin package size fits within the mechanical constraints of the target enclosure.

Soc System On Chip Part Context

This part belongs to the Zynq UltraScale+ MPSoC EG family, which targets cost-sensitive yet high-performance embedded applications. The EG series distinguishes itself by offering substantial programmable logic and processing power in a standardized package, bridging the gap between standard microprocessors and large-scale FPGAs.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package are limited to other XCZU19EG variants with different speed grades or temperature ratings. Cross-family migration to XCZU7EG or XCZU9EG requires significant schematic and bitstream redesign due to differing logic densities and I/O distributions.