XCZU19EG-2FFVD1760I

Soc System On Chip Overview

The AMD XCZU19EG-2FFVD1760I is a Zynq UltraScale+ MPSoC EG (Enhanced General) series system-on-chip manufactured using 20nm FinFET+ technology. It integrates an ARM Cortex-A53 application processor, dual-core Cortex-R5 real-time processors, and an FPGA fabric with over 1.1 million logic cells. The device operates at industrial temperatures (-40°C to +100°C) and features a speed grade of -2. Key processing capabilities include APU frequencies up to 1.3 GHz, RPU at 600 MHz, and GPU at 667 MHz. It includes 256 KB of on-chip SRAM with ECC and supports external DDR4/LPDDR4 memory interfaces for high-bandwidth data handling.

Soc System On Chip Feature Summary

• Integrated heterogeneous architecture combining Zynq UltraScale+ FPGA fabric with ARM Cortex-A53 and Cortex-R5 processors.
• Industrial temperature range operation from -40°C to +100°C TJ.
• High-performance processing: Quad-core APU up to 1.3 GHz, Dual-core RPU at 600 MHz, and Mali-400 MP2 GPU at 667 MHz.
• Robust memory subsystem including 256 KB on-chip SRAM with ECC and support for various external DRAM standards.

Soc System On Chip Applications

• Real-time control systems requiring deterministic processing via Cortex-R5 cores.
• High-performance embedded computing utilizing the quad-core ARM Cortex-A53 MPCore.
• Complex digital logic design and custom hardware acceleration within the FPGA fabric.
• Video processing and visualization tasks accelerated by the integrated ARM Mali-400 MP2 GPU.

Soc System On Chip Procurement Notes

Verify the specific suffix 'FFVD1760I' against official AMD documentation, as standard datasheets frequently list 'FFVC1760I' or 'FFVB1760I' for this logic density. Confirm package dimensions and pinout compatibility if substituting from other BGA variants in the XCZU19EG family. Ensure sourcing channels provide genuine components with valid traceability records due to the component's classification under export control regulations.

Soc System On Chip Selection Notes

Select this model when industrial temperature stability (-40°C to +100°C) is required alongside high computational density. The -2 speed grade offers a balance between performance and power consumption suitable for complex signal processing. Consider the 1760-pin FCBGA package constraints for PCB layout. Evaluate the need for the specific EG series features versus lower-density models if the 1.1M+ logic cell count exceeds project requirements.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ MPSoC EG series, designed for enhanced general-purpose applications. It sits within the broader AMD FPGA portfolio, bridging the gap between pure programmable logic and embedded processing. The EG variant typically targets demanding industrial and communication infrastructure markets requiring robust reliability and high throughput.

Soc System On Chip Replacement Considerations

Direct replacements within the same package and speed grade include XCZU19EG-1FFVD1760I (slower speed grade) or XCZU19EG-3FFVD1760I (faster speed grade). For identical electrical characteristics but different packaging, consider XCZU19EG-2FFVC1760I or XCZU19EG-2FFVB1760I, provided the board design supports the respective ball grid array configurations.

Soc System On Chip FAQ

What is the maximum operating junction temperature for the XCZU19EG-2FFVD1760I?

The device supports an industrial operating temperature range with a maximum junction temperature (TJ) of +100°C.

Does the XCZU19EG-2FFVD1760I include error correction for its internal memory?

Yes, the chip integrates 256 KB of on-chip SRAM that includes an ECC (Error Correction Code) mechanism to ensure data integrity during real-time processing.

What are the clock speeds for the processing units in this specific speed grade?

In the -2 speed grade, the typical core frequencies are 1.3 GHz for the APU, 600 MHz for the RPU, and 667 MHz for the GPU.