Soc System On Chip XCZU1CG-L2SFVA625E product image

XCZU1CG-L2SFVA625E

$351.39
  • Description:IC ZUP MPSOC LP A53 FPGA 625BGA
  • Series:Zynq® UltraScale+™

SKU:aa2254c4fb73 Category: Brand:

  
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XCZU1CG-L2SFVA625E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC ZUP MPSOC LP A53 FPGA 625BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCZU1CG-L2SFVA625E

  • Description:IC ZUP MPSOC LP A53 FPGA 625BGA
  • Series:Zynq® UltraScale+™
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:-
  • Speed:533MHz, 1.333GHz
  • Primary Attributes:-
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:625-BFBGA, FCBGA
  • Supplier Device Package:625-FCBGA (21x21)

Soc System On Chip datasheet and documents for XCZU1CG-L2SFVA625E

XCZU1CG-L2SFVA625E

Soc System On Chip Overview

The XCZU1CG-L2SFVA625E is a Zynq UltraScale+ MPSoC device featuring an L2 silicon variant with a CG (Dual-Core) configuration. It integrates dual ARM Cortex-A53 application processors and dual ARM Cortex-R5 real-time processors within a 625-ball FCBGA package. The programmable logic section provides 4,680 Adaptive Logic Modules (ALMs) and 3.8 Mbit of embedded memory. Key electrical parameters include a core voltage of 850 mV, an operating temperature range of -40°C to +100°C, and support for 72 I/O pins.

Soc System On Chip Feature Summary

  • L2 Silicon Variant: Enhanced performance characteristics compared to standard silicon grades within the CG family.
  • Dual-Core Processing: Combines dual-core ARM Cortex-A53 MPCore and dual-core ARM Cortex-R5F processors.
  • Compact FPGA Fabric: Offers 4,680 ALMs and 3.8 Mbit embedded memory in a space-efficient form factor.
  • Industrial Temperature Range: Certified for operation between -40°C and +100°C.

Soc System On Chip Applications

  • Sensor processing and fusion systems
  • Industrial motor control applications
  • Low-cost ultrasound imaging devices
  • Traffic engineering infrastructure

Soc System On Chip Procurement Notes

Verify the specific L2 silicon grade requirement against design specifications, as this variant differs from standard or E-grade parts. Confirm that the dual-core CG architecture meets the computational needs, as higher-performance EG variants are available for more demanding workloads. Ensure the 625-ball FCBGA footprint matches the PCB layout constraints.

Soc System On Chip Selection Notes

Select this part when dual-core processing is sufficient for the application logic. The L2 grade offers specific performance benchmarks distinct from other silicon speeds. Compare against the XCZU1CG-2SFVA625I if industrial temperature ratings are required but a different speed grade is acceptable. Consider the XCZU2CG series if double the logic resources are needed.

Soc System On Chip Part Context

This component belongs to the AMD Xilinx Zynq UltraScale+ MPSoC family, specifically the CG sub-series designed for cost-sensitive and resource-constrained embedded applications. The 'L2' designation indicates a specific silicon binning grade, while 'CG' denotes the dual-core processor configuration tailored for control and sensing tasks rather than high-throughput data processing.

Soc System On Chip Replacement Considerations

Direct replacements include other L2 graded parts in the same package, such as XCZU1CG-L2SFVC784E (different package). For functional equivalence with different speed grades, consider XCZU1CG-1SFVA625E or XCZU1CG-2SFVA625E. For increased logic capacity, the XCZU2CG-L2SFVA625E provides doubled ALM resources.

XCZU1CG-L2SFVA625EXCZU1CG-L2SFVA625E
$351.39
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