Soc System On Chip XCZU1EG-2SFVA625I product image

XCZU1EG-2SFVA625I

$423.22
  • Description:IC ZUP MPSOC A53 FPGA 625BGA
  • Series:Zynq® UltraScale+™

SKU:fc7dfdb35aff Category: Brand:

  
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XCZU1EG-2SFVA625I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC ZUP MPSOC A53 FPGA 625BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCZU1EG-2SFVA625I

  • Description:IC ZUP MPSOC A53 FPGA 625BGA
  • Series:Zynq® UltraScale+™
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:-
  • Speed:533MHz, 600MHz, 1.333GHz
  • Primary Attributes:-
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:625-BFBGA, FCBGA
  • Supplier Device Package:625-FCBGA (21x21)

Soc System On Chip datasheet and documents for XCZU1EG-2SFVA625I

XCZU1EG-2SFVA625I

Soc System On Chip Overview

The AMD XCZU1EG-2SFVA625I is a Zynq UltraScale+ MPSoC device featuring an EG series architecture. It integrates a quad-core ARM Cortex-A53 MPCore with CoreSight, dual-core ARM Cortex-R5F with CoreSight, and an ARM Mali-400 MP2 GPU. The programmable logic section provides approximately 81,900 Logic Elements (LE) or 4,680 Adaptive Logic Modules (ALM). Key memory resources include 256 KB of embedded RAM and 3.8 Mbit of block RAM. The device operates at frequencies up to 1.2 GHz for the application processor and 600 MHz for the real-time processor, housed in a 625-ball FCBGA package.

Soc System On Chip Feature Summary

  • Quad-core ARM Cortex-A53 MPCore with CoreSight debugging support
  • Dual-core ARM Cortex-R5F with CoreSight for real-time control
  • Approximately 81,900 Logic Elements (4,680 ALMs) in programmable logic
  • ARM Mali-400 MP2 GPU for graphics processing

Soc System On Chip Applications

  • Wired and wireless infrastructure systems
  • Data center acceleration and storage controllers
  • Aerospace and defense avionics platforms

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature range (-40°C to +100°C) as per official datasheets. Confirm package dimensions for the 625-FCBGA (21x21 mm) form factor against PCB layout requirements. Ensure compatibility with the Zynq UltraScale+ MPSoC development tools and licensing models before procurement.

Soc System On Chip Selection Notes

Select this model for applications requiring high-performance computing combined with flexible I/O and moderate FPGA fabric capacity. Compare against CG series devices if motor control or sensor fusion is the primary focus, as CG variants offer optimized power efficiency for those specific workloads. Verify that the 81,900 LE count meets the digital logic requirements without excessive over-provisioning.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ MPSoC family, specifically the EG series designed for high-performance infrastructure and data center applications. It sits between the lower-capacity CG series and higher-capacity EV/UG series in terms of logic resources and target market segmentation within the AMD portfolio.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements are limited within the same package. Consider the XCZU1CG-2SFVA625I for similar form factors but different performance profiles, or the XCZU2EG-1SFVA625I for upgraded logic resources in the same footprint, subject to design re-validation.

XCZU1EG-2SFVA625IXCZU1EG-2SFVA625I
$423.22
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