XCZU1EG-L1SFVC784I

Soc System On Chip Overview

The XCZU1EG-L1SFVC784I is a Zynq UltraScale+ MPSoC device from the EG series, manufactured by AMD. It integrates a quad-core ARM Cortex-A53 application processor and a dual-core ARM Cortex-R5 real-time processor with programmable logic resources. The component utilizes a 784-ball FCBGA package and operates within an industrial temperature range of -40°C to +100°C. Key electrical parameters include a core voltage of 850 mV, 154,350 logic elements, 8,820 adaptive logic modules (ALMs), and 7.6 Mbit of embedded memory.

Soc System On Chip Feature Summary

• Quad-core ARM Cortex-A53 MPCore processor for high-performance computing
• Dual-core ARM Cortex-R5F processor for deterministic real-time control
• Integrated Mali-400 MP2 GPU for graphics acceleration
• Supports PCIe Gen2/Gen3, USB 3.0, SATA, and Gigabit Ethernet interfaces

Soc System On Chip Applications

• Wireless infrastructure base stations
• Data center acceleration and networking
• Aerospace and defense systems
• Industrial automation controllers

Soc System On Chip Procurement Notes

Verify the specific suffix 'L1' against official AMD documentation to confirm it denotes the extended industrial temperature grade (-40°C to +100°C) rather than standard commercial grade. Confirm package availability and lead times directly with authorized distributors or AMD sales representatives, as supply status varies by region.

Soc System On Chip Selection Notes

Select this model when a balance of processing power and cost is required for infrastructure applications. The EG series offers four A53 cores compared to the two in the CG series, providing higher throughput for complex algorithms while maintaining lower resource usage than the EV series. Ensure the design accommodates the 784-pin FCBGA footprint and thermal requirements for the specified operating temperature range.

Soc System On Chip Part Context

This part belongs to the Zynq UltraScale+ MPSoC family, which combines ARM processors with Xilinx FPGA fabric. The XCZU1EG variant specifically targets entry-level infrastructure and industrial markets, offering a middle ground between the lower-resource CG series and the video-capable EV series. It shares the same 784-pin package form factor as other devices in the SFVC784 category.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package include XCZU1EG-1SFVC784E (commercial grade) or XCZU1CG-1SFVC784I (dual-core A53). For upgraded performance, consider the XCZU3EG-L2SFVC784E, though verification of software compatibility and resource mapping is required.