Soc System On Chip XCZU2CG-2UBVA530E product image

XCZU2CG-2UBVA530E

$316.03
  • Description:IC SOC CORTEX-A53 530BGA
  • Series:-

SKU:c2d301af0c07 Category: Brand:

  
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XCZU2CG-2UBVA530E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC SOC CORTEX-A53 530BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCZU2CG-2UBVA530E

  • Description:IC SOC CORTEX-A53 530BGA
  • Series:-
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:533MHz, 1.3GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:530-WFBGA, FCBGA
  • Supplier Device Package:530-FCBGA (16x9.5)

Soc System On Chip datasheet and documents for XCZU2CG-2UBVA530E

XCZU2CG-2UBVA530E

Soc System On Chip Overview

The AMD XCZU2CG-2UBVA530E is a Zynq UltraScale+ MPSoC System on Chip featuring an FPGA fabric with 103K+ logic units. It integrates a dual-core ARM Cortex-A53 MPCore application processor and a dual-core ARM Cortex-R5 real-time processor, both equipped with CoreSight debug capabilities. The device includes 256KB of RAM and supports various peripherals including DMA and WDT. Connectivity options encompass CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG, and MMC/SD/SDIO interfaces. Operating temperatures range from -40°C to 100°C (TJ), housed in a 530-WFBGA package.

Soc System On Chip Feature Summary

  • Integrates heterogeneous processing system combining high-performance application cores with real-time control cores for complex embedded tasks.
  • Provides hardware-adaptable FPGA fabric suitable for sensor fusion and industrial IoT applications.
  • Supports diverse communication protocols including Ethernet and CANbus for robust connectivity.

Soc System On Chip Applications

  • Sensor processing and fusion
  • Motor control systems
  • Industrial Internet of Things (IoT) devices

Soc System On Chip Procurement Notes

Verify the specific suffix 'E' indicates the extended temperature grade (-40°C to 100°C TJ). Confirm the package type matches the 530-WFBGA footprint requirements for your PCB design. Ensure compatibility with the required peripheral interfaces such as CANbus or Ethernet depending on the target application. Cross-reference the exact part number against official Xilinx/AMD distribution channels to avoid counterfeit components.

Soc System On Chip Selection Notes

Select this model when 103K+ logic resources are sufficient for the FPGA implementation. Choose the CG variant for cost-sensitive applications requiring moderate performance. Verify that the dual-core A53 and R5 configuration meets the computational load requirements. Consider the 530-pin BGA package constraints during mechanical design. Compare against XCZU2CG-L variants if lower power consumption is prioritized over maximum clock speeds.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ MPSoC family, specifically the CG series designed for cost-effective embedded solutions. It shares architectural similarities with other CG models like XCZU2CG-1UBVA530I but differs in speed grading and temperature rating. The CG series targets applications balancing performance with power efficiency, distinct from higher-end Ultrascale+ devices.

Soc System On Chip Replacement Considerations

XCZU2CG-1UBVA530E offers similar architecture with potentially different speed grades. XCZU2CG-L1UBVA530I provides low-power optimization. Verify pinout and electrical specifications before substituting. No direct single-part replacement exists without evaluating speed bin and thermal requirements.

XCZU2CG-2UBVA530EXCZU2CG-2UBVA530E
$316.03
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