XCZU2CG-L2SFVA625E

Soc System On Chip Overview

The AMD XCZU2CG-L2SFVA625E is a Zynq UltraScale+ MPSoC System-on-Chip featuring an ARM Cortex-A53 quad-core application processor and dual ARM Cortex-R5 real-time processors. It integrates programmable logic with 5904 Adaptive Logic Modules (ALMs) and 180 I/O pins. The device includes 5.3 Mbit of embedded memory and operates at maximum clock frequencies of 600 MHz for the A53 cores and 1.5 GHz for the R5 cores. It utilizes an FCBGA-625 package, supports SMD/SMT mounting, and functions within a temperature range of -40°C to +100°C.

Soc System On Chip Feature Summary

• Quad-core ARM Cortex-A53 application processor running up to 600 MHz
• Dual-core ARM Cortex-R5 real-time processors operating up to 1.5 GHz
• Programmable logic fabric containing 5904 ALMs and 5.3 Mbit embedded memory
• FCBGA-625 package with 180 available I/O connections

Soc System On Chip Applications

• Industrial motor control systems
• Sensor processing and fusion applications
• Low-cost ultrasound imaging devices
• Traffic engineering infrastructure

Soc System On Chip Procurement Notes

Verify component authenticity through authorized AMD distributors or certified supply chain partners. Confirm RoHS compliance status and moisture sensitivity level prior to assembly. Ensure ESD protection protocols are strictly followed during handling due to the fine-pitch FCBGA-625 packaging. Validate that the specific speed grade matches system timing requirements.

Soc System On Chip Selection Notes

Select this model when a balance of moderate logic density and cost-effective processing is required. The CG series targets industrial and automotive sectors where sensor fusion and motor control are primary functions. Compare against EG series variants if higher core counts or advanced connectivity features are necessary for complex data center or wireless infrastructure workloads.

Soc System On Chip Part Context

This part belongs to the Zynq UltraScale+ MPSoC family, specifically the CG series designed for industrial and automotive markets. It shares the same silicon architecture as other CG models but differs in package type, speed grade, and temperature rating. The L2 suffix indicates a specific speed bin configuration within the SFVA625 package variant.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements include XCZU2CG-L1SFVA625I and XCZU2CG-1SFVA625I. Verify that the alternative speed grade meets the system's timing constraints. Ensure the temperature range of the substitute component aligns with the operational environment requirements.