XCZU2EG-1SFVC784I

Soc System On Chip Overview

The AMD XCZU2EG-1SFVC784I is a Zynq UltraScale+ MPSoC device featuring an EG-series quad-core ARM Cortex-A53 application processor and dual-core ARM Cortex-R5 real-time processor. It integrates an ARM Mali-400 MP2 GPU and programmable logic with 103,320 logic elements (5,904 ALMs). The SoC includes 5.3 Mbit of embedded memory and supports operation at maximum clock frequencies of 600 MHz for the A53 cores, 667 MHz for the R5 cores, and 1.2 GHz for the FPGA fabric. It utilizes a 784-pin FCBGA package and operates within a junction temperature range of -40°C to +100°C.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining quad-core ARM Cortex-A53, dual-core ARM Cortex-R5, and FPGA fabric
• Programmable logic resource set including 103,320 logic elements and 5.3 Mbit embedded memory
• Integrated ARM Mali-400 MP2 graphics processing unit
• Supports high-speed I/O with 252 available input/output pins

Soc System On Chip Applications

• Wired and wireless infrastructure systems
• Data center acceleration and networking
• Aerospace and defense platforms
• Industrial automation and control

Soc System On Chip Procurement Notes

Verify component authenticity through authorized AMD distribution channels. Confirm RoHS compliance status and moisture sensitivity level (MSL 3) prior to PCB assembly. Ensure proper handling procedures are followed due to the fine-pitch BGA packaging. Cross-reference datasheet revisions to confirm pinout and electrical specifications match design requirements.

Soc System On Chip Selection Notes

Select this model when specific performance requires the EG variant's quad-core A53 configuration rather than the CG or EV series. Evaluate thermal management solutions suitable for the 784-FCBGA package given the 850 mV core voltage requirement. Verify that the 103K+ logic element count meets the complexity of the intended hardware acceleration tasks.

Soc System On Chip Part Context

This part belongs to the Zynq UltraScale+ MPSoC family, specifically the EG series designed for high-performance computing applications. It shares the 784-FCBGA footprint with other variants in the XAZU2EG and XCZU2EG families, differing primarily in speed grades and manufacturing process nodes.

Soc System On Chip Replacement Considerations

Direct functional replacements include other parts within the XAZU2EG and XCZU2EG series with compatible packages. Verify speed grade compatibility, as higher frequency variants may require different thermal designs.