XCZU3CG-1SFVA625I

Soc System On Chip Overview

The AMD XCZU3CG-1SFVA625I is a Zynq UltraScale+ MPSoC device featuring a dual-core Arm Cortex-A53 application processor and a dual-core Arm Cortex-R5 real-time processor. It integrates programmable logic with up to 980K logic cells, 4.7 Mb of embedded memory, and four ARM Mali-400 MP2 GPU cores. The component supports DDR4, LPDDR4, DDR3, and DDR3L memory interfaces. It operates within a junction temperature range of 0°C to 100°C and utilizes an FCBGA-625 package for surface-mount installation.

Soc System On Chip Feature Summary

• Dual-core Arm Cortex-A53 MPCore application processor
• Dual-core Arm Cortex-R5F real-time processor
• Up to 980K logic cells in the programmable fabric
• Integrated ARM Mali-400 MP2 graphics processing unit

Soc System On Chip Applications

• Industrial motor control
• Sensor fusion and processing
• Low-cost ultrasound systems
• Traffic engineering applications

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature rating compliance. Confirm the 'CG' designation corresponds to the dual-core application processor variant. Ensure the FCBGA-625 package dimensions match the target PCB footprint requirements before integration.

Soc System On Chip Selection Notes

Select this model when dual-core processing performance is sufficient for the application workload. Compare against the EG series if quad-core processing power is required for more complex infrastructure tasks. Verify that the available I/O count on the 625-pin package meets the system connectivity needs.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ MPSoC family, specifically the CG sub-series designed for cost-sensitive and performance-efficient applications. It shares the same architectural foundation as higher-end models but offers reduced core counts and logic resources optimized for targeted embedded control scenarios.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package are limited to other variants in the CG series with compatible speed grades. Cross-family migration to EG or EV series requires schematic and firmware redesign due to different core configurations.