XCZU3CG-L2SFVC784E

Soc System On Chip Overview

The AMD XCZU3CG-L2SFVC784E is a Zynq UltraScale+ MPSoC featuring an FCBGA-784 package. It integrates dual-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors with 154,350 logic elements (8,820 ALMs). Key electrical parameters include a maximum clock frequency of 600 MHz for the application processor and 1.5 GHz for the programmable logic. The device provides 7.6 Mbit of embedded memory, 252 I/Os, and operates at 850 mV within a commercial temperature range of 0°C to +100°C.

Soc System On Chip Feature Summary

• Dual-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processing subsystem
• 154,350 logic elements with 7.6 Mbit embedded memory
• FCBGA-784 package with 252 I/Os

Soc System On Chip Applications

• Industrial motor control
• Sensor processing and fusion
• Low-cost ultrasound systems
• Traffic engineering applications

Soc System On Chip Procurement Notes

Verify component authenticity through authorized AMD distribution channels. Confirm RoHS compliance status via official datasheets. Ensure handling procedures account for moisture sensitivity levels specified in the manufacturing documentation.

Soc System On Chip Selection Notes

Select this model for applications requiring dual-core processing capabilities within the CG series. Compare against the XCZU3EG variant if quad-core performance or Mali-400 graphics are required. Verify that the 154k logic element count meets specific design constraints.

Soc System On Chip Part Context

This part belongs to the Zynq UltraScale+ MPSoC CG family, designed for industrial and sensor applications. It shares the 784-pin form factor with other variants but differs in core configuration and feature set compared to EG and EV series devices.

Soc System On Chip Replacement Considerations

Direct substitutes include XCZU3CG-1SFVC784I and XCZU3CG-2SFVC784E. Verify speed grade and temperature rating compatibility before substitution.