Soc System On Chip XCZU3EG-1SBVA484I product image

XCZU3EG-1SBVA484I

$555.82
  • Description:IC SOC CORTEX-A53 484FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG

SKU:00f3d939055a Category: Brand:

  
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XCZU3EG-1SBVA484I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC SOC CORTEX-A53 484FCBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCZU3EG-1SBVA484I

  • Description:IC SOC CORTEX-A53 484FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:500MHz, 600MHz, 1.2GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:484-BFBGA, FCBGA
  • Supplier Device Package:484-FCBGA (19x19)

Soc System On Chip datasheet and documents for XCZU3EG-1SBVA484I

XCZU3EG-1SBVA484I

Soc System On Chip Overview

The AMD XCZU3EG-1SBVA484I is a Zynq UltraScale+ MPSoC device featuring an EG-series quad-core ARM Cortex-A53 application processor and dual-core ARM Cortex-R5 real-time processors. It integrates an FPGA fabric with 8,820 Adaptive Logic Modules (ALMs) and 7.6 Mbit of embedded memory. The SoC includes an ARM Mali-400 MP2 GPU and supports maximum clock frequencies up to 1.5 GHz for the programmable logic. Packaged in a 484-ball FCBGA, it operates within a commercial temperature range of -40°C to +100°C.

Soc System On Chip Feature Summary

  • Quad-core ARM Cortex-A53 application processor cluster
  • Dual-core ARM Cortex-R5 real-time processor cluster
  • FPGA fabric with 8,820 ALMs and 7.6 Mbit embedded memory
  • ARM Mali-400 MP2 graphics processing unit

Soc System On Chip Applications

  • Wired and wireless infrastructure systems
  • Data center acceleration platforms
  • Aerospace and defense avionics
  • Industrial automation controllers

Soc System On Chip Procurement Notes

Verify the specific speed grade suffix (-1) against the design timing requirements. Confirm the package type (SBVA484) matches the PCB footprint. Check RoHS compliance documentation for environmental regulations. Ensure export control classifications are reviewed prior to international procurement.

Soc System On Chip Selection Notes

Select this model for applications requiring high-performance parallel processing alongside deterministic real-time control. The EG series provides sufficient logic resources for complex signal processing. Verify that the 484-ball package density meets the system I/O requirements. Compare power consumption profiles against thermal constraints in the final enclosure.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ MPSoC family, specifically the EG variant designed for high-performance computing tasks. It bridges the gap between general-purpose processing and reconfigurable hardware acceleration. The device is manufactured by AMD Xilinx and serves as a core element in modern adaptive computing architectures.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package and speed grade should be verified against the official AMD compatibility matrix. Cross-family migration may require schematic and firmware modifications.

XCZU3EG-1SBVA484IXCZU3EG-1SBVA484I
$555.82
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