XCZU47DR-1FFVE1156I

Soc System On Chip Overview

The AMD XCZU47DR-1FFVE1156I is a Zynq UltraScale+ RFSoC System on Chip integrating ARM processing systems, FPGA logic, and high-speed RF data converters. It features a quad-core ARM Cortex-A53 application processor and dual-core ARM Cortex-R5 real-time processor. The programmable logic includes approximately 930K logic cells and 4272 DSP slices. The device incorporates eight 14-bit RF-ADCs with a maximum sampling rate of 5 GSPS and eight 14-bit RF-DACs with a maximum sampling rate of 9.85 GSPS. It utilizes a 1156-pin FCBGA package (35x35 mm) and supports an operating junction temperature range of -40°C to 100°C.

Soc System On Chip Feature Summary

• Integrated 8-channel 14-bit RF-ADC (5 GSPS) and 8-channel 14-bit RF-DAC (9.85 GSPS) for direct RF sampling up to 6 GHz.
• Heterogeneous architecture combining quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors with 930K FPGA logic cells.
• High-performance digital signal processing resources including 4272 DSP slices and extensive Block RAM/UltraRAM.
• Industrial temperature rating (-40°C to 100°C TJ) with 1156-ball FCBGA packaging.

Soc System On Chip Applications

• 5G NR and O-RAN base station implementations requiring massive MIMO and beamforming.
• Phased array radar systems and electronic warfare platforms.
• Satellite communication ground stations and spaceborne payloads.
• Wideband signal intelligence (SIGINT) and spectrum monitoring equipment.

Soc System On Chip Procurement Notes

Verify the speed grade suffix carefully; the '1' in XCZU47DR-1FFVE1156I denotes a specific performance tier distinct from the '-2' variant. Confirm the exact datasheet revision and package marking code to ensure compatibility with existing board designs. Check for RoHS3 compliance status and moisture sensitivity level (MSL 4) requirements during storage and handling.

Soc System On Chip Selection Notes

Select this model when the design requires industrial temperature stability (-40°C to 100°C) combined with the specific timing characteristics of the -1 speed grade. Ensure the system power budget accommodates the full RF and logic utilization. Verify that the 1156-pin FCBGA footprint matches the PCB layout constraints, as the 35x35 mm package requires precise thermal management solutions.

Soc System On Chip Part Context

This component belongs to the AMD Zynq UltraScale+ RFSoC family, specifically the 47DR series which offers 930K logic cells. It is part of the third-generation RFSoC lineup designed for high-channel-count applications. The XCZU47DR-1FFVE1156I serves as a lower-speed-grade alternative to the XCZU47DR-2FFVE1156I within the same package and feature set.

Soc System On Chip Replacement Considerations

The XCZU47DR-2FFVE1156I is a pin-compatible alternative with a higher speed grade. Cross-referencing with the official AMD Zynq UltraScale+ RFSoC Selection Guide is required to confirm electrical parameter differences between the -1 and -2 speed grades before substitution.