Soc System On Chip XCZU4CG-1FBVB900E product image

XCZU4CG-1FBVB900E

$1,124.13
  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG

SKU:c030d102d802 Category: Brand:

  
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XCZU4CG-1FBVB900E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC SOC CORTEX-A53 900FCBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCZU4CG-1FBVB900E

  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:500MHz, 1.2GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

Soc System On Chip datasheet and documents for XCZU4CG-1FBVB900E

XCZU4CG-1FBVB900E

Soc System On Chip Overview

The AMD XCZU4CG-1FBVB900E is a Zynq UltraScale+ MPSoC CG series device featuring a dual-core ARM Cortex-A53 MPCore and a dual-core ARM Cortex-R5 processor. It integrates an FPGA fabric with over 192,000 logic cells, 256 KB of RAM, and supports speeds up to 500 MHz for the A53 cores and 1.2 GHz for the R5 cores. The component utilizes a 900-pin FCBGA package (31x31 mm) and provides 204 I/O pins. It operates within a junction temperature range of 0°C to 100°C and includes CoreSight debug capabilities.

Soc System On Chip Feature Summary

  • Dual-core ARM Cortex-A53 MPCore with CoreSight at 500 MHz
  • Dual-core ARM Cortex-R5 MPCore with CoreSight at 1.2 GHz
  • Zynq UltraScale+ FPGA fabric with 192K+ logic cells
  • 900-FCBGA (31x31) package with 204 I/Os

Soc System On Chip Applications

  • Embedded systems requiring mixed processing and programmable logic
  • Industrial automation controllers
  • Networking infrastructure equipment
  • Medical imaging devices

Soc System On Chip Procurement Notes

Verify the specific ordering suffix and revision level against the manufacturer's current datasheet before procurement. Confirm moisture sensitivity level (MSL 4) handling requirements during storage and assembly. Ensure compatibility with the intended PCB footprint and thermal management solution for the 900-FCBGA package.

Soc System On Chip Selection Notes

Select this model when a balance of moderate FPGA resources and dual-core application processing is required. Compare against the XCZU4EV variant if GPU acceleration via Mali-400 is needed, or the XCZU4EG variant for higher performance cores. Verify that the 192K logic cell count meets the design complexity requirements.

Soc System On Chip Part Context

This part belongs to the Zynq UltraScale+ MPSoC CG family, which targets cost-sensitive embedded applications. It shares the same package and pinout as other XCZU4 variants but differs in internal memory, logic capacity, and processor configurations compared to EG and EV series parts.

Soc System On Chip Replacement Considerations

Direct pin-compatible replacements include other XCZU4CG variants with different speed grades or temperature ranges, such as XCZU4CG-L2FBVB900E. Cross-family substitutions like XCZU4EV require verification of software compatibility and resource availability.

XCZU4CG-1FBVB900EXCZU4CG-1FBVB900E
$1,124.13
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