Soc System On Chip XCZU4CG-L2FBVB900E product image

XCZU4CG-L2FBVB900E

$1,797.75
  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG

SKU:13b47c9a65b7 Category: Brand:

  
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XCZU4CG-L2FBVB900E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC SOC CORTEX-A53 900FCBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCZU4CG-L2FBVB900E

  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:500MHz, 1.2GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

Soc System On Chip datasheet and documents for XCZU4CG-L2FBVB900E

XCZU4CG-L2FBVB900E

Soc System On Chip Overview

The XCZU4CG-L2FBVB900E is a Zynq UltraScale+ MPSoC CG series device featuring an FPGA fabric with over 192K logic cells and a dual-core ARM Cortex-A53 processor running at 500MHz. It integrates a dual-core ARM Cortex-R5 real-time processor operating at 1.2GHz. The component utilizes a 900-FCBGA package with 204 I/Os, supports DDR4/LPDDR4 memory interfaces, and includes peripherals such as PCIe Gen2, USB 3.1, and Gigabit Ethernet. Operating temperatures range from 0°C to 100°C.

Soc System On Chip Feature Summary

  • Dual-core ARM Cortex-A53 MPCore with CoreSight
  • Dual-core ARM Cortex-R5F MPCore with CoreSight
  • 192K+ Logic Cells in Zynq UltraScale+ FPGA fabric
  • Integrated ARM Mali-400 MP2 GPU

Soc System On Chip Applications

  • Industrial automation and control systems
  • Medical imaging devices
  • Test and measurement equipment
  • Automotive infotainment and ADAS

Soc System On Chip Procurement Notes

Verify the specific suffix 'L2' against official AMD documentation to confirm it denotes a qualified temperature or extended grade variant rather than a standard commercial part. Confirm RoHS3 compliance status and MSL level 4 handling requirements prior to assembly planning.

Soc System On Chip Selection Notes

Select this model for applications requiring moderate FPGA resources combined with hardened ARM processors. Ensure design constraints align with the 500MHz A53 and 1.2GHz R5 clock speeds. Verify that the 900-ball FCBGA footprint fits the target PCB layout and thermal management strategy.

Soc System On Chip Part Context

This part belongs to the Zynq UltraScale+ MPSoC CG family, which targets cost-sensitive embedded markets. It shares the same silicon die as higher-performance EG/EV variants but features reduced FPGA capacity and fewer high-speed transceivers compared to those models.

Soc System On Chip Replacement Considerations

Direct pin-compatible replacements within the same package are limited due to varying logic cell counts and transceiver configurations. Consult AMD's migration guide for cross-family compatibility between CG, EG, and EV series parts.

XCZU4CG-L2FBVB900EXCZU4CG-L2FBVB900E
$1,797.75
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