XCZU5EG-3SFVC784E

Overview

The XCZU5EG-3SFVC784E is a Zynq UltraScale+ MPSoC EG series System on Chip integrating an FPGA fabric with ARM processors. It features a quad-core ARM Cortex-A53 MPCore and dual-core ARM Cortex-R5, both equipped with CoreSight debug interfaces. The device includes an Arm Mali-400 MP2 GPU and 256 KB of on-chip RAM. The FPGA section provides over 256K logic cells, operating at speeds up to 600 MHz for the A53 cores and 1.5 GHz for the R5 cores. It is housed in a 784-FCBGA package measuring 23x23 mm.

Feature Summary

• Quad-core ARM Cortex-A53 MPCore with CoreSight
• Dual-core ARM Cortex-R5 with CoreSight
• Arm Mali-400 MP2 GPU
• Over 256K FPGA logic cells
• 256 KB on-chip memory

Applications

• Industrial automation controllers
• Medical imaging systems
• Automotive infotainment and instrument clusters
• Wireless infrastructure base stations

Procurement Notes

Verify the specific suffix '3' indicates the -3 speed grade (600MHz/1.5GHz) against design requirements. Confirm the 'EG' variant meets thermal and performance needs compared to other MPSoC families. Check current availability status as supply constraints may affect lead times. Ensure the 784-FCBGA package footprint matches the PCB layout.

Selection Notes

Select this part when high-performance processing is required alongside moderate FPGA resources. The EG series offers a balance between the lower-end CG series and higher-end DR/XR series. Verify that the 256K+ logic cell count suffices for the target hardware design. Consider the integrated peripherals like USB, Ethernet, and SDIO if external controllers are to be eliminated.

Part Context

This component belongs to the Zynq UltraScale+ MPSoC family, specifically the Entry Grade (EG) subset. It combines programmable logic with processing systems, enabling heterogeneous computing architectures. The EG series targets cost-sensitive applications requiring significant processing power without the highest FPGA resource counts found in XR or DR variants.

Replacement Considerations

Direct pin-to-pin replacements within the same package and speed grade should be verified via AMD's official compatibility matrices. Cross-series migration to CG or DR variants requires re-evaluation of logic utilization and thermal profiles. No alternative part numbers are confirmed in the provided data.