XCZU5EG-L2SFVC784E

XCZU5EG-L2SFVC784E

$2,296.06
  • Description:IC SOC CORTEX-A53 784FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG

SKU:d4d090bfa308 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 784FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:533MHz, 600MHz, 1.3GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:784-BFBGA, FCBGA
  • Supplier Device Package:784-FCBGA (23x23)

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XCZU5EG-L2SFVC784E

Overview

The XCZU5EG-L2SFVC784E is a Zynq UltraScale+ MPSoC EG series System on Chip integrating an FPGA fabric with ARM processor subsystems. It features a quad-core ARM Cortex-A53 MPCore and dual-core ARM Cortex-R5 MPCore, both equipped with CoreSight debug interfaces. The device includes an ARM Mali-400 MP2 GPU and supports up to 1.5GHz application processor speeds. It houses over 256K logic units within a 784-pin FCBGA package (23x23 mm). Operating temperatures range from -40°C to 100°C TJ.

Feature Summary

  • Integrated Zynq UltraScale+ MPSoC EG architecture with 256K+ logic units
  • Quad-core ARM Cortex-A53 MPCore and dual-core ARM Cortex-R5 MPCore with CoreSight
  • ARM Mali-400 MP2 graphics processing unit
  • 784-FCBGA package (23x23 mm) supporting high-speed peripherals

Applications

  • Industrial automation and control systems
  • Medical imaging devices
  • Test and measurement equipment
  • Automotive infotainment and instrument clusters

Procurement Notes

Verify the specific speed grade suffix 'L2' against official AMD documentation to confirm performance characteristics. Confirm the 'E' temperature rating aligns with operational requirements of -40°C to 100°C TJ. Ensure compatibility with required DDR memory types and interface standards before procurement.

Selection Notes

Select this model for applications requiring a balance of FPGA flexibility and embedded processing power in industrial environments. Compare against other EG series variants based on specific logic resource needs and I/O pin counts. Verify that the 784-ball BGA footprint fits the target PCB design constraints and thermal management capabilities.

Part Context

This component belongs to the Zynq UltraScale+ MPSoC EG family, designed for ruggedized and industrial applications. It combines programmable logic with hardened ARM processors and GPUs on a single die, enabling heterogeneous computing solutions for complex embedded tasks.

Replacement Considerations

Consult AMD's official cross-reference tools for verified substitutes. Consider other XCZU5EG variants with different speed grades or package options if electrical specifications require adjustment. Ensure any replacement maintains the same EG industrial temperature rating.

XCZU5EG-L2SFVC784EXCZU5EG-L2SFVC784E
$2,296.06
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