XCZU63DR-2FFVE1156I

XCZU63DR-2FFVE1156I

$17,776.69
  • Description:XCZU63DR-2FFVE1156I
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Product Detailed Parameters

  • Description:XCZU63DR-2FFVE1156I
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  • Mfr:AMD
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XCZU63DR-2FFVE1156I

Overview

The XCZU63DR-2FFVE1156I is a Zynq UltraScale+ RFSoC device manufactured by AMD. It integrates a Processing System with quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors alongside a programmable logic fabric and high-speed data converters. The device utilizes an FCBGA-1156 package, measuring 35x35 mm. It operates within an industrial temperature range of -40°C to 100°C TJ. The silicon speed grade is designated as -2. This component belongs to the DR series, which features integrated RF transceivers for direct sampling applications.

Feature Summary

  • Integrates multi-channel RF data converters with high-speed ADCs and DACs for direct RF signal processing.
  • Combines heterogeneous computing resources including ARM application and real-time processors with scalable FPGA logic.
  • Supports high-bandwidth memory interfaces and multiple high-speed serial transceiver standards.

Applications

  • Software-defined radio systems requiring wideband signal acquisition.
  • Phased array radar and electronic warfare platforms.
  • 5G New Radio base station implementations.

Procurement Notes

Verify the complete part number against official AMD documentation to ensure correct speed grade and package configuration. Confirm RoHS compliance status and moisture sensitivity level requirements prior to integration. Check for specific ordering suffixes that may indicate tape-and-reel packaging or specialized testing conditions. Ensure supply chain authorization through AMD-approved distributors to guarantee component authenticity and traceability.

Selection Notes

Compare the XCZU63DR against other DR series variants based on required DSP slice count and Block RAM capacity. Evaluate the available GTH/GTY transceiver bandwidth against target interface protocols such as JESD204B or PCIe. Assess thermal management needs given the high power consumption typical of RFSoC devices in this performance class. Verify pin compatibility if migrating from previous generation Xilinx SoC architectures.

Part Context

This component is part of the Zynq UltraScale+ RFSoC family, designed to merge RF front-end capabilities with general-purpose computing. The DR designation indicates the inclusion of integrated RF data converters, distinguishing it from standard Zynq MPSoC devices. It targets applications demanding high throughput and low latency in signal processing environments.

Replacement Considerations

Direct functional equivalents are limited within the same package. Consider XCZU67DR or XCZU47DR variants for higher resource counts, or XCZU5DR for lower density. Migration requires re-evaluation of logic utilization and power delivery networks due to differences in internal architecture and I/O constraints.

XCZU63DR-2FFVE1156IXCZU63DR-2FFVE1156I
$17,776.69
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