XCZU67DR-1FSVE1156I

XCZU67DR-1FSVE1156I

$15,604.94
  • Description:IC ZUP RFSOC A53 FPGA 1156BGA
  • Series:Zynq® UltraScale+™ RFSoC

SKU:94d0545e0f97 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC ZUP RFSOC A53 FPGA 1156BGA
  • Series:Zynq® UltraScale+™ RFSoC
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:-
  • Connectivity:-
  • Speed:500MHz, 1.2GHz
  • Primary Attributes:Zynq® UltraScale+™ RFSoC
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:1156-BBGA, FCBGA
  • Supplier Device Package:1156-FCBGA (35x35)

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XCZU67DR-1FSVE1156I

Overview

The XCZU67DR-1FSVE1156I is a Zynq UltraScale+ RFSoC device manufactured by AMD. It integrates a programmable logic fabric with an embedded processing system featuring quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors. The component utilizes a 1156-pin FCBGA package and operates within a junction temperature range of -40°C to +100°C. Key electrical specifications include processor speeds of 500 MHz for the A53 cores and 1.2 GHz for the R5 cores, alongside 256 KB of RAM. This SoC FPGA combines high-performance digital signal processing capabilities with general-purpose computing.

Feature Summary

  • Integrates quad-core ARM Cortex-A53 MPCore and dual-core ARM Cortex-R5 processors with CoreSight debug infrastructure.
  • Features Zynq UltraScale+ RFSoC architecture for combined RF and digital signal processing.
  • Available in a 1156-FCBGA (35x35 mm) surface-mount package.
  • Supports industrial operating temperatures from -40°C to +100°C TJ.

Applications

  • Software-defined radio systems requiring integrated RF transceivers.
  • High-performance baseband processing units.
  • Test and measurement equipment utilizing mixed-signal FPGA capabilities.
  • Advanced communication infrastructure nodes.

Procurement Notes

Verify availability status directly with authorized distributors or AMD, as supply constraints may apply. Confirm that the specific suffix 'IES9819' or standard 'I' matches the required temperature grade and packaging specifications. Ensure compliance with export control regulations if applicable to the destination region. Request official datasheets and mechanical drawings prior to integration design.

Selection Notes

Select this model when both high-speed RF data conversion and complex programmable logic are required on a single die. Compare against the XCZU67DR-2FSVE1156I variant if higher clock frequencies (533 MHz/1.333 GHz) are necessary. Ensure the 1156-pin footprint aligns with the PCB layout constraints. Verify power delivery requirements for the 850 mV core voltage and associated I/O standards.

Part Context

This part belongs to the Zynq UltraScale+ RFSoC family, distinct from the MPSoC series which lacks integrated RF transceivers. It shares the 1156-pin package form factor with other devices like the XCZU6EG-1FFVB1156I but differs in internal resource allocation and processor configurations. The 'DR' designation indicates the RFSoC variant within the broader Zynq UltraScale+ portfolio.

Replacement Considerations

The XCZU67DR-2FSVE1156I serves as a functional alternative with increased processor clock speeds. The XCZU67DR-L1FFVE1156I offers a low-power variant option. Direct pin-to-pin replacements within the same package must be verified against specific speed grades and feature sets using official AMD selection guides.

XCZU67DR-1FSVE1156IXCZU67DR-1FSVE1156I
$15,604.94
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