XCZU67DR-2FFVE1156I

XCZU67DR-2FFVE1156I

$19,973.94
  • Description:IC ZUP RFSOC A53 FPGA 1156BGA
  • Series:Zynq® UltraScale+™ RFSoC

SKU:1fcd4a955c21 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC ZUP RFSOC A53 FPGA 1156BGA
  • Series:Zynq® UltraScale+™ RFSoC
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:-
  • Connectivity:-
  • Speed:533MHz, 1.333GHz
  • Primary Attributes:Zynq® UltraScale+™ RFSoC
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:1156-BBGA, FCBGA
  • Supplier Device Package:1156-FCBGA (35x35)

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XCZU67DR-2FFVE1156I

Overview

The XCZU67DR-2FFVE1156I is a Zynq UltraScale+ RFSoC device manufactured by AMD. It integrates a Processing System (PS) with a quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5, alongside a Programmable Logic (PL) fabric and high-speed RF data converters. The PS operates at frequencies up to 1.333 GHz for the A53 cores and 533 MHz for the R5 cores. The device features an FCBGA package with 1156 pins, measuring 35x35 mm. It supports industrial temperature ranges from -40°C to +100°C TJ.

Feature Summary

  • Integrated quad-core ARM Cortex-A53 MPCore and dual-core ARM Cortex-R5 processing systems.
  • High-performance FPGA programmable logic fabric within the UltraScale+ architecture.
  • Direct integration of RF data converters supporting high-speed analog-to-digital and digital-to-analog conversion.
  • Industrial temperature rating (-40°C to +100°C TJ) for robust operation in demanding environments.

Applications

  • Software-defined radio systems requiring direct RF sampling.
  • Advanced radar and electronic warfare platforms.
  • 5G New Radio base stations and Massive MIMO implementations.
  • Broadband signal intelligence and spectrum monitoring equipment.

Procurement Notes

Verify component authenticity through authorized AMD distribution channels or certified partners. Request original manufacturer documentation and traceability records upon order confirmation. Confirm specific speed grades and package variants match design requirements before procurement. Ensure compliance with export control regulations applicable to high-performance semiconductor devices.

Selection Notes

Select this model when multi-channel RF direct sampling is required alongside substantial FPGA compute resources. Compare against other RFSoC variants based on specific ADC/DAC channel counts and DSP slice availability. Verify that the 1156-pin FCBGA footprint aligns with PCB layout constraints and thermal management capabilities. Consider the -2 speed grade performance characteristics relative to system timing requirements.

Part Context

This part belongs to the Zynq UltraScale+ RFSoC family, designed for applications merging RF front-end processing with flexible digital logic. It represents a convergence of ARM processor technology, FPGA programmability, and high-speed mixed-signal conversion on a single die. The DR suffix typically denotes specific resource configurations within the RFSoC portfolio.

Replacement Considerations

Consult official AMD selection guides for pin-compatible or functionally equivalent alternatives within the Zynq UltraScale+ RFSoC series. Verify that any substitute maintains compatible voltage levels, package dimensions, and thermal specifications. Cross-reference feature sets to ensure adequate processing power and I/O availability for the target application.

XCZU67DR-2FFVE1156IXCZU67DR-2FFVE1156I
$19,973.94
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