XCZU6CG-1FFVC900E

Overview

The AMD XCZU6CG-1FFVC900E is a System-on-Chip FPGA from the Zynq UltraScale+ MPSoC CG series, manufactured on a 16nm FinFET+ process. It integrates programmable logic with processing systems including dual-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors. The device features approximately 469K logic elements, 25.1 Mbit of embedded memory, and an ARM Mali-400 MP2 GPU. It operates within a commercial temperature range of 0°C to +100°C TJ and utilizes a 900-ball FCBGA package.

Feature Summary

• Integrated Processing System: Dual-core ARM Cortex-A53 (up to 500 MHz) and dual-core ARM Cortex-R5 (up to 1.2 GHz) with CoreSight debug infrastructure.
• Programmable Logic: Contains 469,446 Logic Elements (LEs), 26,825 Adaptive Logic Modules (ALMs), and 25.1 Mbit of embedded block RAM.
• Graphics Acceleration: Includes an ARM Mali-400 MP2 GPU for graphics processing capabilities.
• High-Speed Interconnects: Equipped with 24 transceivers supporting data rates up to 12.5 Gbps.

Applications

• Industrial automation and control systems
• Artificial intelligence inference at the edge
• Autonomous driving perception modules
• Medical imaging devices
• Test and measurement equipment

Procurement Notes

Verify the specific suffix 'E' indicates commercial temperature grade (0°C to +100°C). Confirm the package type is 900-ball FCBGA. Check RoHS compliance status as per current manufacturer documentation. Ensure moisture sensitivity level (MSL) handling procedures are followed during assembly.

Selection Notes

Select this model when requiring a balance of moderate logic capacity and integrated processing power. Compare against XCZU6EG if higher performance or extended temperature ranges are needed. Verify that the 204 I/O count meets interface requirements. Consider the 16nm process node for power efficiency relative to older generations.

Part Context

This component belongs to the Zynq UltraScale+ MPSoC family, specifically the CG variant which typically offers lower power consumption compared to EG variants. It combines Xilinx FPGA fabric with ARM processor subsystems on a single die, enabling heterogeneous computing architectures.

Replacement Considerations

Direct pin-to-pin replacements may include other XCZU6xx models in the same package, such as XCZU6EG-1FFVC900E, though functional differences exist. Cross-model migration requires verification of logic resource availability and processing system compatibility.