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The XCZU6CG-2FFVB1156I is a Zynq UltraScale+ MPSoC device from AMD, integrating programmable logic with a dual-core ARM Cortex-A53 application processor and dual-core ARM Cortex-R5 real-time processor. Manufactured on a 16nm FinFET+ process, it features approximately 469K logic elements within a 1156-ball FCBGA package. The device supports industrial operating temperatures ranging from -40°C to +100°C and includes an ARM Mali-400 MP2 GPU for graphics processing.
Verify component authenticity through authorized AMD distributors or direct manufacturer channels. Confirm RoHS compliance status and moisture sensitivity level (MSL) ratings prior to assembly. Ensure supply chain documentation matches the specific speed grade and package variant to avoid integration errors.
Select this model when a balance of moderate logic capacity and dual-core processing is required. Compare against the XCZU6CG-1FFVC900I if a smaller 900-ball package suffices. Verify that the 16nm process node meets thermal and performance constraints for the target enclosure design.
This part belongs to the Zynq UltraScale+ MPSoC EG series, designed for embedded applications requiring heterogeneous computing. It combines the flexibility of FPGA fabric with the efficiency of ARM processors, targeting high-performance embedded systems where deterministic real-time control and complex data processing are necessary.
The XCZU6CG-1FFVC900I offers similar functionality in a smaller 900-ball package. For higher logic density, consider the XCZU9CG series. Verify pin compatibility and thermal requirements before substituting any alternative package variants.