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The AMD XCZU6CG-2FFVC900I is a Zynq UltraScale+ MPSoC from the CG series, manufactured using 16nm FinFET+ technology. It integrates a dual-core Arm Cortex-A53 application processor and a dual-core Arm Cortex-R5 real-time processor with programmable logic containing 469K+ logic cells. The device features an Arm Mali-400 MP2 GPU, 256KB of on-chip RAM, and up to 25.1Mb of embedded block RAM. It operates within a junction temperature range of -40°C to +100°C and utilizes a 900-pin FCBGA package measuring 31x31mm.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status and moisture sensitivity level (MSL) ratings prior to assembly. Ensure proper ESD handling procedures are followed during storage and installation to maintain device integrity.
Select this model when a dual-core APU configuration suffices for the application workload. Compare against the EG series if four cores or higher performance metrics are required. Verify that the 469K+ logic cell count meets the specific FPGA resource requirements for the design.
This component belongs to the Zynq UltraScale+ MPSoC family, specifically the CG variant which pairs the programmable logic with a dual-core ARM Cortex-A53 processor. It shares the same 900-FCBGA package footprint as other models in the FFVC900 suffix group, facilitating potential board layout comparisons within the product line.
Direct pin-compatible replacements include other devices sharing the XCZU6CG series designation and FFVC900 package. Verify functional equivalence regarding core counts and logic capacity before substitution.