XCZU6CG-L2FFVC900E

XCZU6CG-L2FFVC900E

$3,227.88
  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG

SKU:f9382f81d179 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:533MHz, 1.3GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

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XCZU6CG-L2FFVC900E

Overview

The AMD XCZU6CG-L2FFVC900E is a System-on-Chip FPGA from the Zynq UltraScale+ MPSoC CG series, housed in a 900-ball FCBGA package. It integrates a quad-core ARM Cortex-A53 processor running up to 1.5 GHz and a dual-core ARM Cortex-R5 processor operating at 600 MHz. The device provides approximately 248K logic cells, 27.5 Mbit of embedded memory, and 204 user I/Os. Key electrical parameters include an 850 mV core voltage and an operating temperature range of 0°C to +100°C.

Feature Summary

  • Quad-core ARM Cortex-A53 MPCore with CoreSight for application processing
  • Dual-core ARM Cortex-R5 MPCore with CoreSight for real-time control
  • Approximately 248K logic cells and 27.5 Mbit embedded memory
  • Integrated high-speed peripherals including PCIe Gen2, USB 3.0, and Gigabit Ethernet

Applications

  • Industrial automation and robotics controllers
  • Medical imaging systems
  • Test and measurement equipment
  • Automotive infotainment and instrument clusters

Procurement Notes

Verify the specific suffix 'L2' against official AMD documentation to confirm speed grade and commercial temperature rating. Ensure supply chain partners provide valid RoHS compliance certificates and moisture sensitivity level (MSL) data prior to assembly. Confirm availability through authorized distributors as standard lead times may vary.

Selection Notes

Select this model when a balance of moderate FPGA fabric size and robust dual-processor capability is required. Compare against the XCZU5CG or XCZU7CG variants if logic density or memory capacity requirements differ. Verify that the 900-ball FCBGA footprint matches the target PCB design constraints.

Part Context

This component belongs to the Zynq UltraScale+ MPSoC CG family, which targets cost-sensitive applications requiring programmable logic alongside ARM processors. It shares the same 900-pin package form factor as other devices in the series, facilitating potential pin-compatible design strategies within the same product line.

Replacement Considerations

Direct pin-compatible replacements within the same package include the XCZU5CG-L2FFVC900E and XCZU7CG-L2FFVC900E. These alternatives offer different logic densities while maintaining identical pinouts. Cross-family substitutes require significant schematic and layout modifications.

XCZU6CG-L2FFVC900EXCZU6CG-L2FFVC900E
$3,227.88
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