XCZU6EG-1FFVC900I

Overview

The AMD XCZU6EG-1FFVC900I is a Zynq UltraScale+ MPSoC EG series System on Chip FPGA. It integrates a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 GPU with programmable logic containing 268,255 Adaptive Logic Modules (ALMs). The device features 25.1 Mbit of embedded memory, 24 high-speed transceivers, and 220 I/Os. It operates at maximum clock frequencies of 600 MHz for the R5 cores, 667 MHz for the A53 cores, and 1.5 GHz for the transceivers. The component utilizes an FCBGA-900 package and supports a junction temperature range from -40°C to +100°C.

Feature Summary

• Heterogeneous architecture combining ARM Cortex-A53, Cortex-R5F, and Mali-400 MP2 processors with 268,255 ALMs
• Integrated 25.1 Mbit embedded block RAM and 6.9 Mbit distributed RAM
• 24 GTH/GTY transceivers supporting high-speed serial interfaces
• Industrial operating temperature range of -40°C to +100°C

Applications

• 5G wireless infrastructure baseband processing
• Advanced Driver Assistance Systems (ADAS)
• Industrial IoT edge computing nodes
• Aerospace and defense signal processing

Procurement Notes

Verify RoHS compliance status through official manufacturer documentation before procurement. Confirm moisture sensitivity level handling requirements during storage and assembly. Ensure supply chain authorization from AMD or authorized distributors to guarantee component authenticity and traceability.

Selection Notes

Select this model when requiring a balance between processing power and logic capacity within the 900-pin form factor. Compare against XCZU7EG variants if higher logic density is needed, or XCZU3EG models for reduced cost and resource requirements. Verify that the 220 I/O count meets interface specifications.

Part Context

This part belongs to the Zynq UltraScale+ MPSoC EG family, which specifically includes an embedded GPU alongside the standard processor cores. It is manufactured using 16nm FinFET+ technology. The 'I' suffix denotes industrial temperature rating, while 'FFVC900' indicates the specific ball grid array package configuration.

Replacement Considerations

Direct pin-to-pin replacements within the same package are limited to other XCZU6EG speed grades or variants like XCZU6EG-2FFVC900I. Cross-family upgrades require schematic and software redesign due to differing resource counts.