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The XCZU6EG-2FFVB1156E is a Zynq UltraScale+ MPSoC device from AMD/Xilinx, integrating an FPGA fabric with a quad-core ARM Cortex-A53 processor subsystem and dual ARM Cortex-R5 real-time processors. It features up to 400K logic cells within the FPGA section. The SoC includes an ARM Mali-400 MP2 GPU and extensive peripheral interfaces such as USB, Ethernet, and PCIe. The component is housed in a 1156-ball FCBGA package measuring 35x35 mm, designed for high-performance embedded applications requiring adaptive computing capabilities.
Verify the specific suffix 'E' against official AMD documentation to confirm it denotes the commercial temperature grade (0°C to 100°C TJ). Ensure compatibility with the required PCB footprint for the 1156-FCBGA package. Confirm current availability status through authorized distributors as supply levels may vary.
Select this model when the design requires approximately 400K logic cells combined with a quad-core A53 application processor. Compare against the XCZU5CG or XCZU9EG if different logic densities or memory configurations are needed. Verify that the 1156-pin BGA package fits the mechanical constraints of the target enclosure.
This part belongs to the Zynq UltraScale+ MPSoC EG family, which targets high-performance embedded markets. It sits between lower-density CG parts and higher-density EG/ES parts in terms of FPGA resource count. The EG series typically offers optimized performance for graphics and multimedia workloads alongside general-purpose processing.
Direct pin-to-pin replacements within the same package are limited to other XCZU6 variants with compatible speed grades. For different logic capacities, consider the XCZU5EG or XCZU9EG, though these require schematic and layout modifications due to differing I/O counts and power requirements.