XCZU6EG-2FFVC900I

Overview

The AMD XCZU6EG-2FFVC900I is a Zynq UltraScale+ MPSoC EG series System-on-Chip FPGA. It integrates a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and ARM Mali-400 MP2 GPU with programmable logic containing 26,825 Adaptive Logic Modules (ALMs). The device features 25.1 Mbit of embedded memory, 24 high-speed transceivers, and 220 I/Os in a 900-pin FCBGA package. Operating frequencies reach up to 1.5 GHz for the PL, 667 MHz for the A53, and 600 MHz for the R5. It supports an industrial temperature range from -40°C to +100°C.

Feature Summary

• Heterogeneous architecture combining ARM Cortex-A53, Cortex-R5F, and Mali-400 MP2 with 26,825 ALMs
• 24 GTH/GTY transceivers supporting high-speed serial interfaces
• 25.1 Mbit embedded block RAM and 6.9 Mbit distributed RAM
• Industrial grade operation (-40°C to +100°C) with 900-FCBGA packaging

Applications

• 5G wireless infrastructure baseband processing
• Advanced Driver Assistance Systems (ADAS)
• Industrial IoT edge computing nodes
• Aerospace and defense signal processing

Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature rating (-40°C to +100°C) compared to commercial variants. Confirm RoHS compliance status via the manufacturer datasheet. Check for moisture sensitivity labeling as the component requires controlled storage conditions. Ensure the 900-FCBGA footprint matches the target PCB design constraints.

Selection Notes

Select this model when requiring the EG series integration of GPU and quad-core A53 within the XCZU6EG logic density tier. Compare against XCZU6EG-2FFVC900E if commercial temperature range suffices. Validate that 26,825 ALMs meet the programmable logic requirements without over-specifying resources available in larger devices like the XCZU15EG.

Part Context

This part belongs to the Zynq UltraScale+ MPSoC EG family, designed for applications needing both high-performance processing and flexible hardware acceleration. It sits between lower-density models and the flagship XCZU15EG, offering a balance of compute power and logic capacity for complex embedded systems.

Replacement Considerations

Direct pin-to-pin replacements include other speed grades or temperature variants within the XCZU6EG series, such as XCZU6EG-1FFVC900I or XCZU6EG-3FFVC900E, provided timing and thermal specifications are met.