XCZU6EG-L1FFVB1156I

XCZU6EG-L1FFVB1156I

$3,452.06
  • Description:IC SOC CORTEX-A53 1156FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG

SKU:95c877eace36 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 1156FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:500MHz, 600MHz, 1.2GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:1156-BBGA, FCBGA
  • Supplier Device Package:1156-FCBGA (35x35)

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XCZU6EG-L1FFVB1156I

Overview

The AMD XCZU6EG-L1FFVB1156I is a Zynq UltraScale+ MPSoC EG series device integrating an ARM-based processing system with programmable logic. It features a quad-core ARM Cortex-A53 MPCore, dual-core ARM Cortex-R5F, and an ARM Mali-400 MP2 GPU. The programmable logic section provides approximately 268,255 Adaptive Logic Modules (ALMs) and 25.1 Mbit of embedded memory. Key electrical parameters include a core voltage of 850 mV, maximum clock frequencies of 600 MHz for the A53/R5 cores and 1.5 GHz for the GPU, and operation within a temperature range of -40°C to +100°C.

Feature Summary

  • Heterogeneous multi-core architecture combining ARM Cortex-A53, Cortex-R5F, and Mali-400 MP2 processors
  • Approximately 268,255 ALMs and 25.1 Mbit embedded memory in the programmable logic fabric
  • Integrated high-speed serial transceivers and 352 user I/Os
  • Supports DDR4, LPDDR4, DDR3, and other dynamic memory interfaces

Applications

  • Industrial automation and control systems
  • Medical imaging equipment
  • Wireless infrastructure base stations
  • Automotive infotainment and advanced driver assistance systems

Procurement Notes

Verify the specific suffix 'L1' against official AMD documentation to confirm it denotes the industrial temperature grade (-40°C to +100°C). Ensure compatibility with required PCB footprint and thermal management solutions for the 1156 FCBGA package. Cross-reference the exact part number with current AMD datasheets to confirm availability status and any potential obsolescence notices.

Selection Notes

Select this model when both high-performance application processing and real-time control are required on a single chip. The XCZU6EG offers a balance of logic resources and processor performance suitable for complex embedded designs. Compare logic density and memory capacity against higher-end EG variants if additional PL resources are needed. Verify that the 1156-pin package fits the mechanical constraints of the target enclosure.

Part Context

This component belongs to the Zynq UltraScale+ MPSoC EG family, designed for demanding embedded applications requiring high reliability and performance. The EG series specifically targets industrial, medical, and automotive sectors with extended temperature ranges and enhanced robustness compared to standard commercial grades.

Replacement Considerations

Direct pin-to-pin replacements within the same package may include other XCZU6EG variants with different speed grades or temperature ratings, such as XCZU6EG-1FFVB1156E. Higher resource models like XCZU9EG or XCZU11EG in the same package may serve as upward alternatives if logic capacity is insufficient.

XCZU6EG-L1FFVB1156IXCZU6EG-L1FFVB1156I
$3,452.06
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