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The AMD XCZU7CG-2FBVB900I is a System-on-Chip (SoC) FPGA from the Zynq UltraScale+ MPSoC CG series. It integrates dual ARM Cortex-A53 application processors, dual ARM Cortex-R5 real-time processors, and an FPGA fabric with over 192K logic cells. The device operates at frequencies up to 1.2 GHz for the APU and 600 MHz for the RPU. It features 204 user I/Os and utilizes a 900-pin FCBGA package. Designed for industrial applications, it supports a junction temperature range of 0°C to 100°C.
Verify the specific speed grade suffix '2' against the official AMD datasheet to confirm frequency ratings and timing constraints. Ensure the industrial temperature rating aligns with system thermal requirements. Confirm RoHS compliance status through the manufacturer's current documentation before procurement.
Select this model when dual-core processing is sufficient compared to the quad-core EG series. Compare logic cell counts and memory resources against the CG-L variant if lower power consumption is required. Verify that the 204 I/O count meets interface requirements without needing additional bridge components.
This component belongs to the Zynq UltraScale+ MPSoC CG family, which targets cost-sensitive embedded applications requiring heterogeneous computing. It shares the same physical package as other 900-pin variants but differs in processor core configuration and logic capacity.
Direct pin-compatible replacements within the same package include the XCZU7CG-L2FBVB900E for extended temperature ranges or the XCZU7EG-2FBVB900E for increased processing performance. Verify software compatibility when migrating between CG and EG series due to potential differences in available resources.