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The XCZU7CG-L1FBVB900I is a System-on-Chip FPGA from the Zynq UltraScale+ MPSoC CG series, manufactured by AMD. It integrates dual ARM Cortex-A53 MPCore processors with CoreSight and dual ARM Cortex-R5 processors with CoreSight. The device features over 504K logic cells within its FPGA fabric, operating at frequencies up to 500 MHz for the A53 cores and 1.2 GHz for the R5 cores. Packaged in a 900-ball FCBGA (31x31 mm) format, it supports industrial temperature ranges from -40°C to +100°C. Key connectivity interfaces include CANbus, Ethernet, I²C, SPI, UART, USB OTG, and MMC/SD/SDIO.
Verify the specific suffix 'L' against official AMD documentation to confirm frequency binning and feature set variations. Ensure compatibility with required power delivery designs for the 850 mV core voltage. Confirm moisture sensitivity level handling requirements during assembly to prevent package damage.
Select this model when dual-core application processing and real-time control via dual R5 cores are required alongside moderate FPGA resources. Compare against the XCZU7CG-1FBVB900I if higher clock speeds or different I/O counts are needed. Evaluate thermal management solutions suitable for the 900-FCBGA package under maximum load conditions.
This component belongs to the Zynq UltraScale+ MPSoC CG family, designed for cost-sensitive embedded applications requiring heterogeneous computing. It shares the same silicon die as other variants in the XCZU7CG series but differs in speed grading and pinout configuration defined by the L1FBVB900I designation.
Direct replacements include other XCZU7CG variants such as XCZU7CG-1FFVF1517E or XCZU7EG-1FBVB900E, provided pin compatibility and resource requirements match. Verify that the alternative part number supports the necessary I/O count and memory interface specifications.