XCZU7CG-L1FBVB900I

XCZU7CG-L1FBVB900I

$3,084.44
  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG

SKU:782ad95e5456 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:500MHz, 1.2GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

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XCZU7CG-L1FBVB900I

Overview

The XCZU7CG-L1FBVB900I is a System-on-Chip FPGA from the Zynq UltraScale+ MPSoC CG series, manufactured by AMD. It integrates dual ARM Cortex-A53 MPCore processors with CoreSight and dual ARM Cortex-R5 processors with CoreSight. The device features over 504K logic cells within its FPGA fabric, operating at frequencies up to 500 MHz for the A53 cores and 1.2 GHz for the R5 cores. Packaged in a 900-ball FCBGA (31x31 mm) format, it supports industrial temperature ranges from -40°C to +100°C. Key connectivity interfaces include CANbus, Ethernet, I²C, SPI, UART, USB OTG, and MMC/SD/SDIO.

Feature Summary

  • Dual ARM Cortex-A53 and Dual ARM Cortex-R5 processing subsystems with CoreSight integration
  • FPGA fabric with 504K+ logic cells and adaptive logic modules
  • Industrial temperature range operation (-40°C to +100°C)
  • Comprehensive peripheral support including Ethernet, USB OTG, and CANbus

Applications

  • Industrial automation and control systems
  • Embedded vision and machine learning edge devices
  • Telecommunications infrastructure equipment
  • Medical imaging and diagnostic systems

Procurement Notes

Verify the specific suffix 'L' against official AMD documentation to confirm frequency binning and feature set variations. Ensure compatibility with required power delivery designs for the 850 mV core voltage. Confirm moisture sensitivity level handling requirements during assembly to prevent package damage.

Selection Notes

Select this model when dual-core application processing and real-time control via dual R5 cores are required alongside moderate FPGA resources. Compare against the XCZU7CG-1FBVB900I if higher clock speeds or different I/O counts are needed. Evaluate thermal management solutions suitable for the 900-FCBGA package under maximum load conditions.

Part Context

This component belongs to the Zynq UltraScale+ MPSoC CG family, designed for cost-sensitive embedded applications requiring heterogeneous computing. It shares the same silicon die as other variants in the XCZU7CG series but differs in speed grading and pinout configuration defined by the L1FBVB900I designation.

Replacement Considerations

Direct replacements include other XCZU7CG variants such as XCZU7CG-1FFVF1517E or XCZU7EG-1FBVB900E, provided pin compatibility and resource requirements match. Verify that the alternative part number supports the necessary I/O count and memory interface specifications.

XCZU7CG-L1FBVB900IXCZU7CG-L1FBVB900I
$3,084.44
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