XCZU7EG-1FBVB900E

Overview

The XCZU7EG-1FBVB900E is a Zynq UltraScale+ MPSoC EG series System on Chip integrating FPGA fabric with ARM processors. It features a quad-core ARM Cortex-A53 MPCore, dual-core ARM Cortex-R5, and an ARM Mali-400 MP2 GPU. The device includes over 504K logic cells, 256KB of embedded RAM, and supports speeds up to 1.2GHz for the processor subsystem. Packaged in a 900-ball FCBGA (31x31 mm) format, it operates within a junction temperature range of 0°C to 100°C.

Feature Summary

• Integrated SoC architecture combining Zynq UltraScale+ FPGA fabric with ARM Cortex-A53, Cortex-R5, and Mali-400 MP2 cores
• FPGA resources include 504K+ logic cells and 256KB embedded RAM
• Supports multiple high-speed interfaces including Ethernet, USB OTG, SPI, I2C, UART, CANbus, and MMC/SD/SDIO
• Available in a 900-BBGA/FCBGA package with 204 I/O pins

Applications

• Industrial automation and control systems
• Medical imaging devices
• Test and measurement equipment
• Wireless infrastructure base stations

Part Context

This component belongs to the AMD Xilinx Zynq UltraScale+ MPSoC family, specifically the EG series designed for extended industrial temperature ranges. It combines programmable logic with processing subsystems to enable heterogeneous computing solutions for complex embedded applications requiring both real-time control and high-level processing capabilities.

Replacement Considerations

Compatible variants within the same package include the XCZU7EV-1FBVB900E and XCZU7CG-1FBVB900E. Selection should be based on required speed grades, power consumption profiles, and specific temperature operating ranges defined in the official datasheet.