XCZU7EG-2FBVB900I

XCZU7EG-2FBVB900I

$3,778.25
  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG

SKU:25ac43b144d7 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:533MHz, 600MHz, 1.3GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

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XCZU7EG-2FBVB900I

Overview

The AMD XCZU7EG-2FBVB900I is a Zynq UltraScale+ MPSoC Enhanced Graphics (EG) device in the 900-FCBGA package. It integrates a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and Mali-400 MP2 GPU with programmable logic containing over 504K logic cells. Key electrical parameters include a maximum A53 clock frequency of 1.5 GHz, R5 frequency of 600 MHz, and GPU frequency of 1.2 GHz. The device features 28,800 Adaptive Logic Modules (ALMs), 11 Mbit embedded memory, and 24 high-speed transceivers. It operates within a junction temperature range of -40°C to +100°C.

Feature Summary

  • Heterogeneous architecture combining quad-core Cortex-A53, dual-core Cortex-R5F, and Mali-400 MP2 GPU with 504K+ FPGA logic cells
  • High-performance interconnect including AXI Cache Coherent Interconnect (CCI-400) for PS/PL data consistency
  • Integrated security features supporting ARM TrustZone, Secure Boot, and hardware key storage
  • Support for TSN (Time-Sensitive Networking) and IEEE 1588 PTP via integrated Ethernet controllers

Applications

  • Industrial automation and robotics requiring deterministic real-time control
  • Advanced Driver Assistance Systems (ADAS) and automotive vision processing
  • 5G wireless infrastructure and baseband processing
  • Medical imaging systems and high-definition video processing

Procurement Notes

Verify the specific speed grade suffix '2' against project timing requirements, as it dictates the maximum operating frequencies for the processor cores and transceivers. Confirm that the industrial temperature rating (-40°C to +100°C) aligns with the environmental constraints of the target deployment. Ensure design compatibility with the 900-FCBGA footprint and associated thermal management solutions.

Selection Notes

Select this model when enhanced graphics capabilities are required alongside high-end FPGA resources. The EG series distinguishes itself from EV models by including the Mali-400 MP2 GPU. Compare logic cell counts and transceiver speeds against alternative part numbers like the XCZU7EV or XCZU9EG to ensure the resource allocation matches the specific signal processing and I/O bandwidth demands of the system architecture.

Part Context

This component belongs to the Zynq UltraScale+ MPSoC EG family, designed for applications demanding both high-level processing and flexible hardware acceleration. It utilizes 16nm FinFET+ technology to integrate Arm processors with ASIC-like performance on a single die. The device serves as a central processing unit for complex embedded systems, replacing multi-chip solutions with a unified platform for compute, control, and connectivity.

Replacement Considerations

Direct functional replacements within the same package and feature set include the XCZU7EG-1FBVB900I and XCZU7EG-3FBVB900I. These variants share the same core architecture but differ in speed grades and logic density. Verify pinout compatibility and timing specifications before substituting.

XCZU7EG-2FBVB900IXCZU7EG-2FBVB900I
$3,778.25
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