XCZU7EG-L1FBVB900I

XCZU7EG-L1FBVB900I

$3,306.50
  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG

SKU:d3960c7f2c5f Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:500MHz, 600MHz, 1.2GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

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XCZU7EG-L1FBVB900I

Overview

The XCZU7EG-L1FBVB900I is an industrial-grade System-on-Chip FPGA from the AMD Xilinx Zynq UltraScale+ MPSoC Enhanced Graphics (EG) family. It integrates a Processing System with quad-core ARM Cortex-A53 processors, dual-core ARM Cortex-R5 processors, and an ARM Mali-400 MP2 GPU, alongside programmable logic resources. The device features approximately 504,000 logic cells, 28,800 Adaptive Logic Modules, and 11 Mbit of embedded memory. It operates within a temperature range of -40°C to +100°C and utilizes a 900-ball FCBGA package.

Feature Summary

  • Heterogeneous multi-core architecture combining quad-core ARM Cortex-A53 (up to 1.5 GHz), dual-core ARM Cortex-R5 (up to 600 MHz), and ARM Mali-400 MP2 GPU.
  • High-performance programmable logic with 504K+ logic cells, 28,800 ALMs, and 1,728 DSP slices supporting up to 5.3 TMAC/s.
  • Integrated high-speed serial transceivers including GTH, GTY, and PS-GTR types with data rates up to 32.75 Gb/s.
  • Industrial operating temperature range (-40°C to +100°C) ensuring reliability in demanding environments.

Applications

  • Industrial automation and control systems requiring hard real-time processing.
  • Vision processing and machine learning inference at the edge.
  • Telecommunications infrastructure and baseband processing.
  • Medical imaging devices and diagnostic equipment.

Procurement Notes

Verify the specific suffix 'L1' against official AMD documentation to confirm it denotes a standard or low-power variant, as suffix definitions can vary by generation. Ensure compatibility with required I/O standards and power delivery specifications for the target PCB design. Confirm moisture sensitivity level handling requirements during assembly.

Selection Notes

Select this model when both high-level application processing via Cortex-A53 and deterministic real-time control via Cortex-R5 are required on a single chip. The EG series is suitable for applications needing enhanced graphics capabilities compared to the EV series. Evaluate the 504K logic cell count against algorithm complexity to ensure sufficient programmable resources for custom hardware acceleration.

Part Context

This component belongs to the Zynq UltraScale+ MPSoC EG series, which targets high-performance embedded vision and industrial applications. It differs from the EV series by offering enhanced graphics processing capabilities through the Mali-400 MP2 GPU. The 'I' suffix indicates industrial temperature rating, while 'L1' typically specifies a particular binning or power configuration within the EG family.

Replacement Considerations

Direct pin-to-pin replacements within the same package may include other XCZU7EG variants such as XCZU7EG-1FBVB900I or XCZU7EG-2FBVB900I, depending on speed grade and feature set requirements. Cross-series migration to EV models requires verification of GPU availability and logic resource equivalence.

XCZU7EG-L1FBVB900IXCZU7EG-L1FBVB900I
$3,306.50
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