XCZU7EG-L2FBVB900E

XCZU7EG-L2FBVB900E

$3,778.25
  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG

SKU:70fa53431b8a Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:533MHz, 600MHz, 1.3GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

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XCZU7EG-L2FBVB900E

Overview

The XCZU7EG-L2FBVB900E is an UltraScale+ Embedded FPGA from AMD, featuring a 28nm process technology. It integrates ARM Cortex-A53 processors with programmable logic, offering high performance for embedded applications. The device supports up to 16GB of DDR4 memory and includes extensive I/O capabilities. Key specifications include 700K logic cells, 1.2M DSP slices, and 10.8Mb block RAM. It operates at typical supply voltages of 0.85V and 1.8V, ensuring efficient power consumption while delivering robust computational throughput for complex system-on-chip designs.

Feature Summary

  • Integrates dual ARM Cortex-A53 processors with programmable logic for heterogeneous computing
  • Features 700K logic cells and 1.2M DSP slices for high-performance signal processing
  • Supports up to 16GB DDR4 memory interface with integrated PHY
  • Includes extensive connectivity options with PCIe Gen3/Gen4 and USB 3.0 controllers

Applications

  • Industrial automation and control systems
  • Medical imaging devices requiring real-time processing
  • Telecommunications infrastructure equipment
  • Automotive infotainment and advanced driver assistance systems

Procurement Notes

Verify the specific suffix 'L2' indicates commercial temperature range and 'B900E' denotes the package variant. Confirm RoHS compliance status through official AMD documentation. Ensure compatibility with required development tools like Vivado Design Suite. Check for any regional export restrictions or licensing requirements associated with the embedded processor cores before procurement.

Selection Notes

Select this model when both high-density programmable logic and embedded processing are required in a single device. Compare against lower-density variants if resource utilization is below 50%. Consider thermal management solutions due to the high pin count and power density. Verify that the BGA-900 package fits within the mechanical constraints of the target enclosure.

Part Context

This part belongs to the UltraScale+ Embedded FPGA family, bridging the gap between traditional FPGAs and SoCs. It combines the flexibility of FPGA fabric with the efficiency of ARM processors. The XCZU7EG series targets mid-to-high-end applications requiring significant data throughput and low latency. It serves as a direct successor to earlier Zynq-7000 embedded platforms with enhanced performance metrics.

Replacement Considerations

Direct substitutes may include other XCZU7EG variants with different package or temperature ratings. Cross-reference with Xilinx (AMD) official migration guides for pin-compatible alternatives. Ensure software compatibility when moving between closely related part numbers within the same family tier.

XCZU7EG-L2FBVB900EXCZU7EG-L2FBVB900E
$3,778.25
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