XCZU7EV-3FBVB900E

Overview

The XCZU7EV-3FBVB900E is a Zynq UltraScale+ MPSoC Enhanced Graphics (EG) device from AMD Xilinx, featuring a 900-ball FCBGA package. It integrates a quad-core ARM Cortex-A53 application processor running up to 1.5 GHz, dual-core ARM Cortex-R5 real-time processors at 600 MHz, and a Mali-400 MP2 GPU. The programmable logic section provides 504,000 logic elements and 28,800 Adaptive Logic Modules (ALMs). Embedded memory totals 11 Mbit, with 220 available I/O pins. Operating temperatures range from 0°C to +100°C.

Feature Summary

• Heterogeneous architecture combining quad-core Cortex-A53, dual-core Cortex-R5F, and Mali-400 MP2 GPU
• High-performance FPGA fabric with 504,000 logic elements and 28,800 ALMs
• Integrated DDR4/LPDDR4 controller supporting high-bandwidth memory interfaces
• Comprehensive peripheral set including PCIe Gen3 x4, 1GbE/10GbE, USB 3.0, and TSN support

Applications

• Industrial automation and control systems requiring deterministic real-time processing
• Visual processing and machine vision applications leveraging GPU acceleration
• Telecommunications infrastructure utilizing Time-Sensitive Networking (TSN)
• Medical imaging devices requiring high-throughput data processing

Part Context

This component belongs to the Zynq UltraScale+ MPSoC Enhanced Graphics (EG) family, specifically the -3 speed grade variant within the FBVB900 package. The 'EV' suffix denotes the Enhanced Graphics series optimized for visual workloads, distinguishing it from standard EV or CG series parts by its specific integration of graphics capabilities alongside the programmable logic.

Replacement Considerations

Compatible alternatives within the same package include the XCZU7EV-2FBVB900E and XCZU7EV-1FBVB900E, which offer lower speed grades. For pin-compatible upgrades with higher performance, the XCZU11EG-3FBVB900E is available in the same footprint but requires verification of power and thermal constraints.