XCZU7EV-3FFVF1517E

XCZU7EV-3FFVF1517E

$5,629.13
  • Description:IC SOC CORTEX-A53 1517FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EV

SKU:40b15402e0b4 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 1517FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EV
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:600MHz, 1.5GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:1517-BBGA, FCBGA
  • Supplier Device Package:1517-FCBGA (40x40)

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XCZU7EV-3FFVF1517E

Overview

The AMD XCZU7EV-3FFVF1517E is a Zynq UltraScale+ MPSoC EG device featuring an FCBGA-1517 package. It integrates a quad-core ARM Cortex-A53 MPCore, dual-core ARM Cortex-R5F, and an ARM Mali-400 MP2 GPU. The FPGA fabric provides 28,800 Adaptive Logic Modules (ALMs) and 11 Mbit of embedded memory. Operating frequencies reach up to 600 MHz for the R5 cores, 667 MHz for the GPU, and 1.5 GHz for the A53 cores. The device supports 488 I/Os and operates within a junction temperature range of 0°C to +100°C.

Feature Summary

  • Heterogeneous SoC architecture combining quad-core ARM Cortex-A53, dual-core ARM Cortex-R5F, and ARM Mali-400 MP2 GPU
  • FPGA fabric with 28,800 ALMs and 11 Mbit embedded memory
  • High-speed connectivity supporting PCIe Gen2, USB 3.1, SATA 3.0, DisplayPort, and Gigabit Ethernet
  • Dynamic memory interface compatibility with DDR4, LPDDR4, DDR3, DDR3L, and LPDDR3

Applications

  • Industrial automation and control systems
  • Medical imaging equipment
  • Wireless infrastructure base stations
  • Test and measurement instruments

Procurement Notes

Verify the specific speed grade suffix '3' against the official AMD datasheet to confirm maximum operating frequencies and timing constraints. Ensure the FCBGA-1517 package dimensions match the PCB footprint design. Confirm RoHS compliance status through the manufacturer's current documentation before finalizing procurement specifications.

Selection Notes

Select this model when high-performance processing is required alongside programmable logic in a compact form factor. The XCZU7EV variant offers enhanced video capabilities compared to standard EG parts. Evaluate the 11 Mbit embedded memory capacity against application requirements to determine if external memory interfaces are necessary for data buffering.

Part Context

This component belongs to the Zynq UltraScale+ MPSoC EG series, designed for applications requiring advanced video processing and multimedia features. The EG designation indicates specific enhancements over the standard EG family, particularly regarding display and video input/output capabilities integrated into the silicon.

Replacement Considerations

Direct pin-to-pin replacements within the same package may include other speed grades of the XCZU7EV series, such as -1 or -2 variants, provided frequency requirements are met. Cross-family migration to XCZU9EG or XCZU11EG requires redesign due to different logic resources and pin counts.

XCZU7EV-3FFVF1517EXCZU7EV-3FFVF1517E
$5,629.13
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