XCZU7EV-L1FBVB900I

XCZU7EV-L1FBVB900I

$3,483.94
  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EV

SKU:a66cba12ba13 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EV
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:500MHz, 600MHz, 1.2GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

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XCZU7EV-L1FBVB900I

Overview

The XCZU7EV-L1FBVB900I is a Zynq UltraScale+ MPSoC from AMD Xilinx, integrating an ARM Cortex-A53 application processor subsystem with an FPGA fabric. It features four Cortex-A53 cores and dual Cortex-R5 real-time processors alongside a Mali-400 MP2 GPU. The device provides over 504,000 logic cells, 11 Mbit of embedded block RAM, and 24 high-speed transceivers capable of 16.3 Gb/s data rates. Operating at core voltages of 850 mV, it supports industrial temperatures from -40°C to +100°C within a 900-ball FCBGA package.

Feature Summary

  • Heterogeneous architecture combining quad-core ARM Cortex-A53 (up to 1.5 GHz), dual-core Cortex-R5F (up to 600 MHz), and Mali-400 MP2 GPU.
  • FPGA fabric with 504K+ logic elements, 28,800 ALMs, and 11 Mbit embedded memory for custom acceleration.
  • Integrated DDR4/LPDDR4 controller supporting up to 76.8 GB/s bandwidth with ECC protection.
  • Rich peripheral set including PCIe Gen3 x4, dual 1GbE, USB 3.0/2.0, and TSN support.

Applications

  • Industrial automation and control systems requiring real-time processing.
  • Vision processing and machine learning inference edge devices.
  • Telecommunications infrastructure utilizing Time-Sensitive Networking.
  • Medical imaging equipment requiring low-latency signal processing.

Procurement Notes

Verify the specific suffix 'L1' against the official AMD datasheet to confirm speed grade and feature set. Ensure design compatibility with the 900-ball FCBGA footprint and thermal requirements for the -40°C to +100°C operating range. Confirm supply chain authenticity through authorized distributors due to potential counterfeit risks in high-volume programmable logic markets.

Selection Notes

Select this model when both high-level application processing and deterministic real-time control are required on a single chip. The EV variant offers enhanced graphics capabilities compared to standard versions. Consider the 900-ball package density if board space is constrained but high I/O count is necessary. Validate that the 504K logic cell count meets the complexity of the intended hardware acceleration tasks.

Part Context

This component belongs to the Zynq UltraScale+ MPSoC Enhanced Graphics (EV) family. It shares the same silicon foundation as other EG/EV variants but differs in speed grades, package options, and specific feature enablement codes defined by the suffix. It represents a convergence of programmable logic and processing system technologies for complex embedded applications.

Replacement Considerations

Direct pin-to-pin replacements within the same package may include XCZU7EG or XCZU7CG variants, provided the logic capacity and processor configurations align with the design requirements. Verify electrical parameters and timing constraints before substitution.

XCZU7EV-L1FBVB900IXCZU7EV-L1FBVB900I
$3,483.94
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