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The XCZU9CG-1FFVC900I is a System-on-Chip FPGA from the AMD/Xilinx Zynq UltraScale+ MPSoC family, housed in a 900-ball FCBGA package. It integrates four ARM Cortex-A53 cores and two ARM Cortex-R5 cores with maximum clock frequencies of 600 MHz and 1.5 GHz, respectively. The device features 34,260 Adaptive Logic Modules (ALMs), 32.1 Mbit of embedded memory, and 24 high-speed transceivers. Operating within a temperature range of -40°C to +100°C, it utilizes an 850 mV core voltage and provides 220 I/O pins for system connectivity.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status and moisture sensitivity level (MSL 4) prior to assembly. Ensure proper handling procedures are followed due to the fine-pitch BGA packaging. Check for specific ordering suffixes that may indicate package variations or temperature grades.
Select this model when both hard processor system performance and flexible FPGA fabric are required. Compare against other Zynq UltraScale+ variants based on specific logic resource counts, memory capacity, and transceiver speeds. Ensure the 900-ball package fits the board layout constraints. Validate power supply requirements for the 850 mV core voltage domain.
This part belongs to the Zynq UltraScale+ MPSoC EG series, combining ARM processors with Xilinx FPGA technology. It is designed for applications needing secure, connected, and intelligent edge solutions. The XCZU9CG variant offers a specific balance of logic resources and memory suitable for mid-to-high complexity embedded systems.
Consult official AMD documentation for qualified pin-to-pin or functional replacements within the Zynq UltraScale+ family. Verify compatibility of software tools and bitstreams before substituting components.