XCZU9CG-2FFVB1156E

XCZU9CG-2FFVB1156E

$3,921.69
  • Description:IC SOC CORTEX-A53 1156FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG

SKU:b7e21fde54b4 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 1156FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:533MHz, 1.3GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:1156-BBGA, FCBGA
  • Supplier Device Package:1156-FCBGA (35x35)

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XCZU9CG-2FFVB1156E

Overview

The AMD XCZU9CG-2FFVB1156E is a System-on-Chip FPGA from the Zynq UltraScale+ MPSoC EG series, manufactured on a 16nm FinFET+ process. It integrates a dual-core ARM Cortex-A53 MPCore application processor and a dual-core ARM Cortex-R5 real-time processor, alongside programmable logic containing approximately 469K logic elements. The device features an embedded 256KB RAM and supports various high-speed interfaces including Ethernet, USB OTG, and SPI. Operating within a junction temperature range of -40°C to 100°C, it is housed in a 1156-pin FCBGA package measuring 35x35 mm.

Feature Summary

  • Dual-core ARM Cortex-A53 MPCore with CoreSight for application processing
  • Dual-core ARM Cortex-R5 MPCore with CoreSight for real-time control
  • Approximately 469K+ logic elements in the programmable fabric
  • Integrated 256KB RAM with DMA and WDT peripherals

Applications

  • Industrial automation systems requiring real-time control
  • Artificial intelligence edge computing nodes
  • Autonomous driving sensor fusion platforms
  • Next-generation ADAS hardware implementations

Procurement Notes

Verify the specific speed grade suffix (e.g., -2) against design timing requirements. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure ESD handling protocols are followed due to the moisture sensitivity classification associated with the FCBGA package type.

Selection Notes

Select this model when a dual-core A53 configuration is sufficient, distinguishing it from the quad-core EG variant. Evaluate the 469K logic element count against design complexity. Consider the 1156-pin footprint for PCB layout constraints compared to smaller packages like the 900-pin FFVC.

Part Context

This component belongs to the Zynq UltraScale+ MPSoC family, which utilizes InFO packaging technology to reduce size by 60% and thickness by 70% compared to traditional BGA packages. It sits between the lower-density CG devices and higher-density EG/EV variants in terms of processing cores and logic resources.

Replacement Considerations

XCZU9CG-2FFVB1156I: Identical electrical specifications with extended industrial temperature range (-40°C to +100°C). XCZU9EG-2FFVB1156E: Quad-core A53 upgrade with Mali GPU support.

XCZU9CG-2FFVB1156EXCZU9CG-2FFVB1156E
$3,921.69
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