XCZU9CG-2FFVC900E

XCZU9CG-2FFVC900E

$3,470.13
  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG

SKU:e0b1995a8921 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:533MHz, 1.3GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

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XCZU9CG-2FFVC900E

Overview

The XCZU9CG-2FFVC900E is a System-on-Chip (SoC) FPGA from the AMD Xilinx Zynq UltraScale+ MPSoC CG series. It integrates programmable logic with processing systems on a single die using 16nm FinFET+ technology. The device features a quad-core ARM Cortex-A53 processor cluster and a dual-core ARM Cortex-R5 real-time processor cluster, both equipped with CoreSight debug interfaces. The programmable logic section provides approximately 599,550 Logic Elements (LEs) or 34,260 Adaptive Logic Modules (ALMs). Embedded memory resources total 32.1 Mbit, comprising embedded block RAM and distributed RAM. The component operates within a junction temperature range of 0°C to +100°C and utilizes a 900-ball FCBGA package.

Feature Summary

  • Quad-core ARM Cortex-A53 application processor cluster running up to 600 MHz
  • Dual-core ARM Cortex-R5 real-time processor cluster running up to 1.5 GHz
  • Approximately 599K Logic Elements (LEs) in the programmable logic fabric
  • Integrated 32.1 Mbit embedded memory and 8.8 Mbit distributed RAM

Applications

  • Industrial automation and control systems
  • Artificial intelligence inference accelerators
  • Autonomous driving perception modules
  • High-performance networking infrastructure

Procurement Notes

Verify the specific speed grade suffix '2' against design timing requirements before procurement. Confirm that the 900-FCBGA package dimensions align with the target PCB footprint. Ensure supply chain sources provide original manufacturer packaging to maintain moisture sensitivity level integrity during storage and handling.

Selection Notes

Select this model when a balance of high-end processing power and moderate FPGA capacity is required. The CG series offers lower logic density compared to EG or PG variants while maintaining identical processing system cores. Verify that the 220 I/O count meets interface requirements, as other packages in the family may offer different pin counts.

Part Context

This part belongs to the Zynq UltraScale+ MPSoC CG family, which targets cost-sensitive applications requiring significant processing capability but less programmable logic than higher-tier models. It shares the same processing subsystem architecture as the XCZU9EG variant but differs in FPGA resource allocation and potentially thermal characteristics.

Replacement Considerations

Direct functional replacements include other XCZU9CG variants with different speed grades or package options, such as XCZU9CG-2FFVB1156I. Cross-family upgrades to the EG series are possible if additional logic resources are needed, though pinouts and power configurations may differ.

XCZU9CG-2FFVC900EXCZU9CG-2FFVC900E
$3,470.13
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