XCZU9CG-2FFVC900I

XCZU9CG-2FFVC900I

$3,965.25
  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG

SKU:7de3955dc2ce Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:533MHz, 1.3GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

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XCZU9CG-2FFVC900I

Overview

The AMD XCZU9CG-2FFVC900I is a Zynq UltraScale+ MPSoC EG series system-on-chip utilizing 16nm FinFET+ technology. It integrates a dual-core Arm Cortex-A53 application processor, a dual-core Arm Cortex-R5 real-time processor, and an Arm Mali-400 MP2 GPU with approximately 599K logic units in the programmable logic fabric. The device features 256KB of on-chip RAM and supports up to 1.3GHz for the APU and 600MHz for the RPU. Packaged in a 900-pin FCBGA (31x31mm) with 204 user I/Os, it operates within an industrial temperature range of -40°C to 100°C junction temperature.

Feature Summary

  • Dual-core Arm Cortex-A53 APU running at frequencies up to 1.3GHz
  • Approximately 599K logic units in the Zynq UltraScale+ FPGA fabric
  • Industrial operating temperature range (-40°C to 100°C TJ)
  • Integrated Arm Mali-400 MP2 GPU supporting OpenGL ES 1.1/2.0

Applications

  • Industrial automation and control systems
  • Artificial intelligence inference endpoints
  • Autonomous driving perception modules

Procurement Notes

Verify component authenticity through authorized AMD distribution channels. Confirm the specific suffix 'I' denotes the industrial temperature grade (-40°C to 100°C). Ensure compatibility with the 900-FCBGA package dimensions (31x31mm) during PCB layout. Check current supply status as availability may be restricted.

Selection Notes

Select this model when a dual-core APU configuration is sufficient, distinguishing it from the quad-core XCZU9EG variant. Verify that the 599K logic unit count meets the design requirements, as higher-capacity models like the XCZU15EG offer over 747K units. Ensure the 900-pin footprint aligns with the target board design constraints.

Part Context

This part belongs to the Zynq UltraScale+ MPSoC EG family, which pairs an Arm Cortex-A53 processor with an Arm Mali-400 MP2 GPU. It shares the 900-FCBGA package form factor with other variants in the series but differs in core counts and logic capacity compared to CG or EG sub-series counterparts.

Replacement Considerations

Direct functional replacements include the XCZU9CG-2FFVC900E (commercial grade) if temperature ratings allow. For increased performance, consider the XCZU15EG-2FFVC900I, which offers more logic resources and a quad-core APU.

XCZU9CG-2FFVC900IXCZU9CG-2FFVC900I
$3,965.25
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