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The AMD XCZU9CG-2FFVC900I is a Zynq UltraScale+ MPSoC EG series system-on-chip utilizing 16nm FinFET+ technology. It integrates a dual-core Arm Cortex-A53 application processor, a dual-core Arm Cortex-R5 real-time processor, and an Arm Mali-400 MP2 GPU with approximately 599K logic units in the programmable logic fabric. The device features 256KB of on-chip RAM and supports up to 1.3GHz for the APU and 600MHz for the RPU. Packaged in a 900-pin FCBGA (31x31mm) with 204 user I/Os, it operates within an industrial temperature range of -40°C to 100°C junction temperature.
Verify component authenticity through authorized AMD distribution channels. Confirm the specific suffix 'I' denotes the industrial temperature grade (-40°C to 100°C). Ensure compatibility with the 900-FCBGA package dimensions (31x31mm) during PCB layout. Check current supply status as availability may be restricted.
Select this model when a dual-core APU configuration is sufficient, distinguishing it from the quad-core XCZU9EG variant. Verify that the 599K logic unit count meets the design requirements, as higher-capacity models like the XCZU15EG offer over 747K units. Ensure the 900-pin footprint aligns with the target board design constraints.
This part belongs to the Zynq UltraScale+ MPSoC EG family, which pairs an Arm Cortex-A53 processor with an Arm Mali-400 MP2 GPU. It shares the 900-FCBGA package form factor with other variants in the series but differs in core counts and logic capacity compared to CG or EG sub-series counterparts.
Direct functional replacements include the XCZU9CG-2FFVC900E (commercial grade) if temperature ratings allow. For increased performance, consider the XCZU15EG-2FFVC900I, which offers more logic resources and a quad-core APU.