XCZU9CG-L1FFVB1156I

Overview

The XCZU9CG-L1FFVB1156I is a Zynq UltraScale+ MPSoC device from the CG series, manufactured by AMD. It integrates programmable logic with processing systems on a single die using 16nm FinFET+ technology. The device features 599,550 logic elements and 34,260 Adaptive Logic Modules (ALMs). It includes dual-core ARM Cortex-A53 processors operating at up to 600 MHz and dual-core ARM Cortex-R5 processors. The unit utilizes an FCBGA-1156 package and supports a junction temperature range of -40°C to +100°C.

Feature Summary

• Integrates 599K+ logic elements with 34,260 ALMs in a 16nm FinFET+ architecture
• Dual-core ARM Cortex-A53 MPCore application processors running at 600 MHz
• Dual-core ARM Cortex-R5F real-time processors for deterministic control tasks
• Embedded memory comprising 8.8 Mbit distributed RAM and 32.1 Mbit embedded block RAM

Applications

• Industrial automation controllers requiring mixed signal processing and control
• Medical imaging systems utilizing integrated video and compute capabilities
• Automotive infotainment and instrument cluster displays
• Test and measurement equipment needing high-speed data acquisition

Procurement Notes

Verify the specific suffix 'L1' against official AMD documentation to confirm speed grade and commercial temperature rating. Ensure compatibility with required power delivery specifications for the 850 mV core voltage. Confirm moisture sensitivity level handling requirements during assembly due to the FCBGA package type.

Selection Notes

Select this model when design requirements exceed the capacity of the ZU6CG series but do not necessitate the higher resource counts of the EG or DR variants. Compare against the XCZU9EG variant if GPU acceleration via Mali-400 is required, as the CG series omits the graphics processor. Evaluate thermal management needs given the dense integration in the 1156-ball package.

Part Context

This component belongs to the Zynq UltraScale+ MPSoC CG family, which targets cost-sensitive applications compared to the EG and DR series. It shares the same FPGA fabric size as the EG series but excludes the Mali-400 MP2 GPU. The part number indicates the L1 speed grade and FFVB1156 package configuration within the Xilinx product hierarchy.

Replacement Considerations

Direct pin-compatible replacements within the same package include other XCZU9CG variants with different speed grades, such as XCZU9CG-2FFVB1156I. Cross-series migration to XCZU9EG requires software adaptation for the presence of the GPU core.