XCZU9CG-L2FFVC900E

XCZU9CG-L2FFVC900E

$3,965.25
  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG

SKU:a904fce7b1da Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG
  • Mfr:AMD
  • Package:Bulk
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:533MHz, 1.3GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

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XCZU9CG-L2FFVC900E

Overview

The XCZU9CG-L2FFVC900E is a Zynq UltraScale+ MPSoC EG device from AMD, integrating an FPGA fabric with a quad-core ARM Cortex-A53 processor and dual-core ARM Cortex-R5 real-time processors. It features approximately 34,260 Adaptive Logic Modules (ALMs) and 32.1 Mbit of embedded memory within a 900-ball FCBGA package. The processing system supports clock speeds up to 1.5 GHz for the A53 cores and 600 MHz for the R5 cores. This component is designed for high-performance embedded applications requiring combined programmable logic and processing capabilities.

Feature Summary

  • Quad-core ARM Cortex-A53 MPCore with CoreSight debug support
  • Dual-core ARM Cortex-R5F MPCore with CoreSight debug support
  • Approximately 34,260 ALMs in the programmable logic fabric
  • Integrated ARM Mali-400 MP2 GPU

Applications

  • Industrial automation and control systems
  • Medical imaging devices
  • Wireless infrastructure equipment
  • Test and measurement instruments

Procurement Notes

Verify the specific suffix 'L' against official AMD documentation to confirm if it denotes a specific temperature grade or reliability class, as standard datasheets typically list XCZU9CG-2FFVC900E. Confirm RoHS compliance status and moisture sensitivity level (MSL) ratings prior to ordering to ensure compatibility with assembly processes.

Selection Notes

Select this model when design requirements include a balance of moderate FPGA resources and robust processing performance. Compare against the XCZU9EG variant if higher logic density or different I/O counts are required. Ensure the 900-ball FCBGA package fits the board layout constraints and thermal management strategy.

Part Context

This part belongs to the Zynq UltraScale+ MPSoC EG series, which targets cost-sensitive yet high-performance embedded markets. The EG series typically offers optimized resource configurations compared to the broader ZU family, providing a specific mix of processing power and logic capacity suitable for targeted industrial and commercial applications.

Replacement Considerations

Direct pin-to-pin replacements may include other speed grades of the XCZU9CG series, such as XCZU9CG-1FFVC900E or XCZU9CG-3FFVC900E, provided timing requirements are met. Verify functional equivalence regarding clock frequencies and I/O standards before substitution.

XCZU9CG-L2FFVC900EXCZU9CG-L2FFVC900E
$3,965.25
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