XCZU9EG-1FFVB1156E

Overview

The AMD XCZU9EG-1FFVB1156E is a Zynq UltraScale+ MPSoC EG series device featuring an FCBGA-1156 package. It integrates a quad-core ARM Cortex-A53 MPCore running up to 1.5 GHz, a dual-core ARM Cortex-R5F MPCore operating at 600 MHz, and an ARM Mali-400 MP2 GPU clocked at 667 MHz. The FPGA fabric provides approximately 599K logic cells, 34,260 Adaptive Logic Modules (ALMs), and 32.1 Mbit of embedded memory. Key peripherals include 24 high-speed transceivers, DDR4/LPDDR4 interfaces, PCIe Gen2, USB 3.1, and SATA 3.0. The component operates within a junction temperature range of 0°C to 100°C.

Feature Summary

• Integrated SoC with Quad-Core ARM Cortex-A53 (up to 1.5 GHz) and Dual-Core ARM Cortex-R5F (up to 600 MHz)
• FPGA Fabric with ~599K Logic Cells, 34,260 ALMs, and 32.1 Mbit Embedded Memory
• ARM Mali-400 MP2 Graphics Processing Unit operating at 667 MHz
• High-Speed Connectivity including 24 Transceivers, PCIe Gen2, USB 3.1, and SATA 3.0

Applications

• Industrial automation and control systems
• Medical imaging equipment
• Test and measurement instrumentation
• Wireless infrastructure base stations

Procurement Notes

Verify the specific suffix 'E' indicates the commercial temperature grade (0°C to 100°C TJ). Confirm package dimensions for the 1156-FCBGA (35x35 mm) footprint during PCB layout. Check current supply status as availability may vary by region. Ensure design tools support the Zynq UltraScale+ MPSoC EG family architecture.

Selection Notes

Select this model for applications requiring high-performance processing alongside flexible FPGA logic. Compare against XCZU9EG-2FFVB1156E if higher frequency performance or extended temperature ranges are required. Consider the XCZU9EG-L1FFVB1156I variant for industrial temperature specifications (-40°C to +100°C). Evaluate power consumption requirements given the 850 mV core voltage.

Part Context

This part belongs to the Zynq UltraScale+ MPSoC EG series, designed for cost-sensitive embedded applications. It shares the same silicon die and core architecture as other XCZU9EG variants but differs in speed grades and temperature ratings. The EG series typically offers optimized performance for general-purpose embedded computing tasks compared to the DR or RF variants.

Replacement Considerations

Direct functional replacements include XCZU9EG-2FFVB1156E (higher speed grade) or XCZU9EG-L1FFVB1156I (industrial temperature). Verify pin-to-pin compatibility and thermal characteristics when substituting.