SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AMD XCZU9EG-1FFVB1156I is a Zynq UltraScale+ MPSoC Enhanced Graphics (EG) device built on a 16nm FinFET+ process. It integrates a quad-core ARM Cortex-A53 MPCore application processor, a dual-core ARM Cortex-R5F real-time processor, and an ARM Mali-400 MP2 GPU. The programmable logic subsystem provides approximately 599,500 logic elements and 32.1 Mbit of embedded memory. Key electrical parameters include maximum clock frequencies of 600 MHz for the Cortex-A53, 667 MHz for the Mali-400 MP2, and 1.5 GHz for the Cortex-R5F. The component operates within a temperature range of -40°C to +100°C TJ and utilizes a 1156-ball FCBGA package.
Verify the specific speed grade suffix '1' against the official AMD datasheet to confirm the exact frequency bins for the A53, R5, and GPU cores. Ensure the FFVB1156 package variant matches the board design constraints. Confirm RoHS compliance status through the manufacturer's material declaration documents prior to integration.
Select this model when the application requires enhanced graphics processing via the Mali-400 MP2 alongside substantial FPGA resources. Compare the 599K logic element count against larger EG variants like the XCZU11EG if higher throughput is needed. Verify that the 1156-pin FCBGA footprint fits the PCB layout and thermal management strategy.
This part belongs to the Zynq UltraScale+ MPSoC Enhanced Graphics (EG) family, which targets applications needing both high-level processing and hardware acceleration. It shares the same core processor subsystem as other EG devices but differs in programmable logic capacity and I/O availability compared to smaller or larger counterparts in the series.
Direct pin-to-pin replacements within the same package are limited to other speed grades of the XCZU9EG series, such as the XCZU9EG-2FFVB1156I. Cross-series migration to EV or CG variants requires significant schematic and firmware redesign due to differing peripheral sets and logic capacities.