XCZU9EG-1FFVB1156I

XCZU9EG-1FFVB1156I

$3,792.06
  • Description:IC SOC CORTEX-A53 1156FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG

SKU:d3f610f54812 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 1156FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:500MHz, 600MHz, 1.2GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:1156-BBGA, FCBGA
  • Supplier Device Package:1156-FCBGA (35x35)

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XCZU9EG-1FFVB1156I

Overview

The AMD XCZU9EG-1FFVB1156I is a Zynq UltraScale+ MPSoC Enhanced Graphics (EG) device built on a 16nm FinFET+ process. It integrates a quad-core ARM Cortex-A53 MPCore application processor, a dual-core ARM Cortex-R5F real-time processor, and an ARM Mali-400 MP2 GPU. The programmable logic subsystem provides approximately 599,500 logic elements and 32.1 Mbit of embedded memory. Key electrical parameters include maximum clock frequencies of 600 MHz for the Cortex-A53, 667 MHz for the Mali-400 MP2, and 1.5 GHz for the Cortex-R5F. The component operates within a temperature range of -40°C to +100°C TJ and utilizes a 1156-ball FCBGA package.

Feature Summary

  • Heterogeneous multi-core architecture combining quad-core Cortex-A53, dual-core Cortex-R5F, and Mali-400 MP2 GPU
  • High-performance programmable logic with ~599K logic cells and 32.1 Mbit embedded memory
  • Integrated DDR4/LPDDR4 memory controller supporting high-bandwidth data transfer
  • Advanced security features including ARM TrustZone and Secure Boot capabilities

Applications

  • Industrial automation and control systems requiring real-time processing
  • Next-generation automotive ADAS applications
  • 5G wireless infrastructure equipment
  • Industrial IoT gateways with graphics interface requirements

Procurement Notes

Verify the specific speed grade suffix '1' against the official AMD datasheet to confirm the exact frequency bins for the A53, R5, and GPU cores. Ensure the FFVB1156 package variant matches the board design constraints. Confirm RoHS compliance status through the manufacturer's material declaration documents prior to integration.

Selection Notes

Select this model when the application requires enhanced graphics processing via the Mali-400 MP2 alongside substantial FPGA resources. Compare the 599K logic element count against larger EG variants like the XCZU11EG if higher throughput is needed. Verify that the 1156-pin FCBGA footprint fits the PCB layout and thermal management strategy.

Part Context

This part belongs to the Zynq UltraScale+ MPSoC Enhanced Graphics (EG) family, which targets applications needing both high-level processing and hardware acceleration. It shares the same core processor subsystem as other EG devices but differs in programmable logic capacity and I/O availability compared to smaller or larger counterparts in the series.

Replacement Considerations

Direct pin-to-pin replacements within the same package are limited to other speed grades of the XCZU9EG series, such as the XCZU9EG-2FFVB1156I. Cross-series migration to EV or CG variants requires significant schematic and firmware redesign due to differing peripheral sets and logic capacities.

XCZU9EG-1FFVB1156IXCZU9EG-1FFVB1156I
$3,792.06
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