XCZU9EG-2FFVB1156I

Overview

The AMD XCZU9EG-2FFVB1156I is a Zynq UltraScale+ MPSoC EG series device integrating ARM Cortex-A53, Cortex-R5 processors, and an FPGA fabric. It features 599,500 logic elements (LEs), 34,260 adaptive logic modules (ALMs), and 32.1 Mbit embedded memory. The processor subsystem includes quad-core A53 cores at up to 1.5 GHz, dual-core R5 cores at 667 MHz, and a Mali-400 MP2 GPU at 600 MHz. It provides 352 I/O pins, 24 high-speed transceivers, and operates within a -40°C to +100°C temperature range using an 850 mV core voltage.

Feature Summary

• Heterogeneous architecture combining quad-core ARM Cortex-A53, dual-core Cortex-R5, and Mali-400 MP2 GPU with 599K+ FPGA logic cells
• High-speed connectivity via 24 GTR/GTH transceivers supporting protocols like PCIe, Ethernet, and SATA
• Integrated DDR4 controller supporting PS-side 4GB and PL-side 2GB configurations at 2400 MHz
• Industrial-grade operation with extended temperature range (-40°C to +100°C) and FCBGA-1156 package

Applications

• Real-time signal processing platforms requiring FPGA-DSP integration
• Industrial automation controllers utilizing mixed-signal I/O and real-time processing
• Communication infrastructure equipment leveraging high-speed serial transceivers
• Embedded vision systems utilizing the integrated Mali-400 MP2 GPU

Procurement Notes

Verify component authenticity through authorized AMD distributors or certified suppliers. Confirm RoHS compliance and material declarations prior to procurement. Check for specific ordering suffixes that may indicate packaging variations or regional restrictions. Ensure supply chain stability due to potential allocation constraints on high-volume SoC devices.

Selection Notes

Select this model when system requirements demand approximately 600K logic resources combined with multi-core ARM processing. Verify thermal management capabilities for the 1156-pin FCBGA package under maximum load conditions. Ensure board design supports the required power sequencing for the 850 mV core voltage and multiple I/O banks.

Part Context

This part belongs to the Zynq UltraScale+ MPSoC EG family, designed for industrial and enterprise applications. It shares the same package footprint as the XCZU15EG variant but offers lower logic density (599K vs 747K LEs). The 'I' suffix denotes the industrial temperature grade, distinguishing it from commercial variants.

Replacement Considerations

The XCZU15EG-2FFVB1156I is a pin-compatible alternative with higher logic capacity. Other Zynq UltraScale+ MPSoCs in the FFVB1156 package may require retargeting of I/O constraints and resource utilization adjustments.