XCZU9EG-3FFVB1156E

XCZU9EG-3FFVB1156E

$5,914.94
  • Description:IC SOC CORTEX-A53 1156FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG

SKU:34f0b1da9442 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 1156FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:600MHz, 1.5GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:1156-BBGA, FCBGA
  • Supplier Device Package:1156-FCBGA (35x35)

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XCZU9EG-3FFVB1156E

Overview

The AMD XCZU9EG-3FFVB1156E is a Zynq UltraScale+ MPSoC Enhanced Graphics (EG) device built on 16nm FinFET technology. It integrates a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and Mali-400 MP2 GPU with programmable logic containing approximately 599K logic elements. The component operates at speed grade -3 within a 1156-pin FCBGA package. Key electrical parameters include a maximum clock frequency of 1.5 GHz for the A53 cores, 600 MHz for the R5 cores, and 667 MHz for the GPU. It features 32.1 Mbit of embedded memory and supports high-speed serial transceivers.

Feature Summary

  • Heterogeneous architecture combining quad-core ARM Cortex-A53, dual-core ARM Cortex-R5, and Mali-400 MP2 GPU with 599K+ FPGA logic elements
  • Integrated high-bandwidth memory controllers supporting DDR4 and LPDDR4 interfaces
  • Advanced security features including ARM TrustZone, Secure Boot, and hardware key storage
  • Support for Time-Sensitive Networking (TSN) and IEEE 1588 PTP via integrated Ethernet MACs

Applications

  • Industrial automation and control systems requiring deterministic real-time processing
  • Automotive advanced driver-assistance systems (ADAS) and infotainment platforms
  • 5G wireless infrastructure and small cell base stations
  • Medical imaging equipment and diagnostic devices
  • Test and measurement instrumentation

Procurement Notes

Verify the specific speed grade (-3) and package variant (FFVB1156) against project requirements to ensure timing closure compatibility. Confirm that the commercial temperature range (0°C to +100°C TJ) aligns with the operational environment. Check for current production status and lead times directly with AMD or authorized distributors, as availability may vary by region.

Selection Notes

Select this model when high-performance graphics acceleration is required alongside robust real-time control capabilities. The EG variant is distinct from CG (Dual Core) and EV (Video Codec) versions; choose EG for applications needing the Mali-400 GPU. Ensure the design can accommodate the 1156-ball FCBGA footprint and meets the power delivery specifications for the 0.85V core voltage domain.

Part Context

This part belongs to the Zynq UltraScale+ MPSoC Enhanced Graphics (EG) family, which scales up from smaller devices like the XCZU7EG. It shares the same processor subsystem architecture as other EG parts but offers higher logic density and memory capacity. The -3 speed grade indicates a lower maximum operating frequency compared to -2 or -1 grades, typically offering a more favorable performance-to-power ratio.

Replacement Considerations

Direct pin-compatible replacements within the same package include other XCZU9EG variants with different speed grades (e.g., XCZU9EG-2FFVB1156E). Cross-family upgrades may require retargeting to larger packages like the FFVC1156 or FFVF1517 found in the XCZU11EG series.

XCZU9EG-3FFVB1156EXCZU9EG-3FFVB1156E
$5,914.94
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