XCZU9EG-L1FFVC900I

XCZU9EG-L1FFVC900I

$3,758.06
  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG

SKU:1da23f2152fb Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:500MHz, 600MHz, 1.2GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

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XCZU9EG-L1FFVC900I

Overview

The AMD XCZU9EG-L1FFVC900I is a Zynq UltraScale+ MPSoC from the Enhanced Graphics (EG) series, integrating heterogeneous processing capabilities on a single chip. It features a Processing System with four ARM Cortex-A53 cores and two ARM Cortex-R5F cores, alongside an Arm Mali-400 MP2 GPU. The Programmable Logic side provides approximately 599K logic cells, 32.1 Mbit of embedded memory, and 24 high-speed transceivers. Packaged in a 900-pin FCBGA, it supports industrial operating temperatures ranging from -40°C to +100°C.

Feature Summary

  • Heterogeneous architecture combining quad-core ARM Cortex-A53, dual-core Cortex-R5F, and Mali-400 MP2 GPU
  • Programmable Logic with ~599K logic cells, 32.1 Mbit embedded memory, and 8.8 Mbit distributed RAM
  • 24 GTH/GTY transceivers supporting high-speed serial interfaces like PCIe Gen3/Gen4 and 100G Ethernet
  • Industrial temperature range operation (-40°C to +100°C) with 900-FCBGA package

Applications

  • 5G wireless infrastructure base stations and small cells
  • Advanced Driver Assistance Systems (ADAS) for automotive applications
  • Industrial IoT gateways requiring real-time control and connectivity
  • Aerospace and defense systems demanding high reliability

Procurement Notes

Verify component authenticity through authorized AMD distributors or certified partners. Confirm RoHS compliance and REACH status prior to integration. Check for moisture sensitivity level (MSL 4) requirements to ensure proper handling during assembly. Validate that the specific suffix matches design specifications, as ordering codes may vary by region or revision.

Selection Notes

Select this model when both high-performance application processing and real-time control are required within a single device. The EG variant is suitable for designs needing GPU acceleration for graphics or video processing. Ensure the 900-pin FCBGA footprint fits the PCB layout constraints. Compare against CG variants if GPU resources are unnecessary to optimize cost and power consumption.

Part Context

This component belongs to the Zynq UltraScale+ MPSoC family, specifically the EG (Enhanced Graphics) subset. It shares the foundational 16nm FinFET+ process technology with other models in the series but distinguishes itself through the inclusion of the Mali-400 MP2 GPU and specific logic cell counts tailored for complex signal processing and multimedia tasks.

Replacement Considerations

Direct pin-to-pin replacements within the same package include other XCZU9EG variants with different speed grades or temperature ranges, such as XCZU9EG-2FFVC900I. Cross-family substitutions require careful evaluation of logic resource availability and processor core configurations.

XCZU9EG-L1FFVC900IXCZU9EG-L1FFVC900I
$3,758.06
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