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XG-2102CA 250.0000M-LGRNL3 is listed in the Oscillators range at ChipApex. The manufacturer field lists EPSON. Its product description is XTAL OSC SO 250.0000MHZ LVDS SMD. Review the specifications below when checking this part for your BOM.
The XG-2102CA 250.0000M-LGRNL3 is a Surface Mount SAW oscillator manufactured by EPSON, operating at a frequency of 250 MHz with LVDS output signals. It functions on a 3.3V supply voltage and features an enable/disable control function. The component utilizes a 6-SMD, No Lead package measuring 7.00mm x 5.00mm x 1.40mm. It offers a frequency stability of ±50ppm and operates within a temperature range of -5°C to +85°C. Maximum supply current is 30mA, with a maximum disabled current of 15mA.
Verify the specific suffix LGRNL3 against official EPSON documentation to confirm pinout compatibility and electrical characteristics. Ensure the procurement source provides valid RoHS3 compliance certificates. Confirm that the supplier handles the component correctly regarding moisture sensitivity level 1 requirements during storage and handling processes.
Select this model when a 250 MHz LVDS oscillator is required for industrial environments. The ±50ppm stability suits general synchronization tasks. Consider the 6-SMD footprint for PCB layout constraints. Verify that the 3.3V logic levels match the receiving circuitry inputs before integration into the design.
This component belongs to the XG-2102CA series of SAW oscillators from EPSON Timing. The series is designed for robust performance in demanding electronic applications. The specific part number indicates the 250 MHz frequency variant with LVDS outputs and industrial temperature rating, distinguishing it from other frequency or output type variants within the same family.
EG-2121CA 250.0000M-LGRNL3 is listed as a similar alternative by EPSON. Verify pin compatibility and electrical specifications before substitution. Other manufacturers may offer equivalent SAW oscillators, but direct replacement requires careful validation of output drive strength and package dimensions.
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