XIO2000AGZZ

Specialized Overview

The XIO2000AGZZ is a PCI Express to PCI Bus Translation Bridge manufactured by Texas Instruments. It operates within an ambient temperature range of -40°C to +85°C and utilizes a 161-ball ball grid array (BGA) package with a fine 0.65 mm pitch, measuring 10 mm by 10 mm. The device supports both forward and reverse bridging functions between PCI Express and legacy PCI buses. It features a 1.5 V core supply voltage and includes internal shared RAM for configuration purposes.

Specialized Feature Summary

• Supports reversible data flow between PCI Express and PCI bus architectures
• Integrates internal memory for system configuration management
• Designed for low power consumption in embedded applications

Specialized Applications

• PCI Express to PCI bridge solutions
• Industrial control systems requiring legacy interface support
• Embedded computing platforms

Specialized Procurement Notes

Verify the specific suffix ZZ against official Texas Instruments documentation to confirm exact packaging and material specifications. Ensure compatibility with required operating temperatures and voltage levels before integration into final designs.

Specialized Selection Notes

Select this component when a bidirectional translation bridge between PCI Express and PCI is required. Consider the BGA package constraints and thermal requirements during PCB layout. Verify that the 1.5 V core voltage aligns with the target system power architecture.

Specialized Part Context

This part belongs to the XIO2000 family of bridges from Texas Instruments. These devices are designed to facilitate connectivity between modern high-speed interfaces and older peripheral standards, enabling system upgrades without complete hardware replacement.

Specialized Replacement Considerations

Public confirmed substitute part numbers include PEX8112 and PEX8114 from PLX Technology/Broadcom, which offer similar PCI Express to PCI bridging capabilities.